SLVSIC5 September   2026 DRV81315-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
    1.     Pin Functions
  6. 5Specification
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Transient thermal impedance and Current capability
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Off state diagnostics (OL, STG)
      2. 6.3.2 Control Interface / Power input
    4. 6.4 Protection Circuits
      1. 6.4.1 Overvoltage clamp
        1. 6.4.1.1 Demagnetization energy capability
          1. 6.4.1.1.1 Single pulse clamping capability
      2. 6.4.2 Overcurrent limit
      3. 6.4.3 Thermal Shutdown (TSD)
        1. 6.4.3.1 Dynamic Overtemperature Stress (ΔTDYN)
        2. 6.4.3.2 Absolute Overtemperature
      4. 6.4.4 Undervoltage Lockout (UVLO)
      5. 6.4.5 Summary of STATUS pin response
  8. 7Application and Implementation
    1. 7.1 Typical Application
      1. 7.1.1 External components
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
    3. 7.3 Thermal Consideration
      1. 7.3.1 Power Dissipation
  9. 8Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Community Resources
    3. 8.3 Trademarks
  10. 9Mechanical, Packaging, and Orderable Information

5.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)±2000V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.