SLVSII7 December   2025 TPSM8D7420 , TPSM8D7620

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range (VIN)
      2. 7.3.2  Bias Supply Regulator (VCC)
      3. 7.3.3  Device Configuration Pin (MSEL)
      4. 7.3.4  Multiphase Output Configuration
      5. 7.3.5  Enable and Adjustable UVLO
      6. 7.3.6  Adjustable Switching Frequency
      7. 7.3.7  Device Synchronization (SYNC)
        1. 7.3.7.1 Clock Locking
      8. 7.3.8  Adjustable Output Voltage (FB)
      9. 7.3.9  Control Loop Compensation (COMP)
      10. 7.3.10 Slope Compensation
      11. 7.3.11 Power-Good Output Voltage Monitoring
      12. 7.3.12 Output Discharge
      13. 7.3.13 Soft-Start (SS)
      14. 7.3.14 Overcurrent Protection (OCP)
      15. 7.3.15 Temperature Output
      16. 7.3.16 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
        1. 7.4.3.1 Peak Current Mode Operation
        2. 7.4.3.2 Diode Emulation
        3. 7.4.3.3 FPWM Mode Operation
        4. 7.4.3.4 Minimum On-time (High Input Voltage) Operation
        5. 7.4.3.5 Dropout
        6. 7.4.3.6 Recovery from Dropout
  9. Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Choosing the Switching Frequency
        3. 8.2.2.3 Setting the Output Voltage
        4. 8.2.2.4 Integrated Inductor Considerations
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 VCC and BOOT Capacitors
        7. 8.2.2.7 Output Capacitor Selection
        8. 8.2.2.8 Compensation Selection
      3. 8.2.3 Application Curves
    3. 8.3 2-PH Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedure
      3. 8.3.3 Application Curves 2-PH
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Thermal Design and Layout
      2. 8.5.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Multiphase Output Configuration

The multiphase buck converter topology is created by putting multiple buck converters in parallel and involves interleaving the phases 360/N degrees apart from one another. Where N is the number of phases. Some advantages to the multiphase buck converter are:

  • Increased output current by N times
  • Reduced output voltage ripple
  • Reduced input current ripple
  • Improved thermal spreading

To configure the device in a multiphase output, the SS, EN, and COMP pins of the respective channels must be tied together as specified in Table 7-3. Review to see what multiphase configurations are supported by this device.

When selecting multiphase or multi-output configurations with this module, the phases are interleaved according to Table 7-2.

Table 7-2 Phase Interleaving per Configuration
CONFIG SW1 SW2
1+1 180°
2+0

The individual channels in the TPSM8D7x20 can be configured as a standalone output, multiphase primary, or multiphase secondary. The primary device in a multiphase stack is always the first channel within the stack. The details of the recommended pin connections for each Primary and Secondary are given in Table 7-3.

Table 7-3 Multiphase Pin Connections
PIN PRIMARY SECONDARY
FB VOUT Resistor Divider NC/Float
EN VIN Resistor Divider or Enable/Control Connect to Primary's EN
SS Connect CSS from this pin to AGND Connect to Primary's SS
COMP Connect compensation network from this pin to AGND Connect to Primary's COMP
PG Connect RPG from this pin to VCC NC/Float