SLVSIN9 June   2026 LM25192-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Related Products
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements for the Serial Control Bus
    7. 6.7 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage Range (VIN)
      2. 7.3.2  High-Voltage Bias Supply Regulators (VCC, VDDA)
      3. 7.3.3  Enable (EN)
      4. 7.3.4  Switching Frequency
      5. 7.3.5  Dual Random Spread Spectrum (DRSS)
      6. 7.3.6  Soft Start
      7. 7.3.7  Output Voltage
      8. 7.3.8  Minimum Controllable On-Time
      9. 7.3.9  Dual Loop Architecture
        1. 7.3.9.1 Voltage Loop Error Amplifier
        2. 7.3.9.2 Current Loop Error Amplifier
      10. 7.3.10 Programmable ILIM
      11. 7.3.11 IOUT Monitor
      12. 7.3.12 Cable Drop Compensation
      13. 7.3.13 Slope Compensation
      14. 7.3.14 Shunt Current Sensing
      15. 7.3.15 Hiccup Mode Current Limiting
      16. 7.3.16 Device Configuration (CNFG)
      17. 7.3.17 Pulse Frequency Modulation (PFM) / Synchronization
      18. 7.3.18 Out-of-Audio Operation
      19. 7.3.19 Thermal Shutdown (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Ready Mode
      4. 7.4.4 Active Mode
      5. 7.4.5 Sleep Mode
  9. Programming
    1. 8.1 I2C Bus Operation
    2. 8.2 Clock Stretching
    3. 8.3 Data Transfer Formats
    4. 8.4 Single READ from a Defined Register Address
    5. 8.5 Sequential READ Starting from a Defined Register Address
    6. 8.6 Single WRITE to a Defined Register Address
    7. 8.7 Sequential WRITE Starting at a Defined Register Address
  10. LM25192-Q1 Registers
  11. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Powertrain Components
        1. 10.1.1.1 Buck Inductor
        2. 10.1.1.2 Output Capacitors
        3. 10.1.1.3 Input Capacitors
        4. 10.1.1.4 Power MOSFETs
        5. 10.1.1.5 EMI Filter
      2. 10.1.2 Error Amplifier and Compensation
    2. 10.2 Typical Application
      1. 10.2.1 High Efficiency, Wide Input, 400kHz, Synchronous Buck Regulator
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Buck Inductor
          2. 10.2.1.2.2 Current-Sense Resistance
          3. 10.2.1.2.3 Output Capacitors
          4. 10.2.1.2.4 Input Capacitors
          5. 10.2.1.2.5 Compensation Components
        3. 10.2.1.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
        1. 10.4.1.1 Power Stage Layout
        2. 10.4.1.2 Gate-Drive Layout
        3. 10.4.1.3 PWM Controller Layout
        4. 10.4.1.4 Thermal Design and Layout
        5. 10.4.1.5 Ground Plane Design
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
        1. 11.2.1.1 PCB Layout Resources
        2. 11.2.1.2 Thermal Design Resources
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Pin Configuration and Functions

LM25192-Q1 RGY 19-Pin VQFN (Top View) Figure 5-1 RGY 19-Pin VQFN (Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
1 VOUTF P Output voltage discharge pin and the VCC bias regulator input. Connect the VOUTF pin to the output side of the respective output capacitor.
2 CNFG/IMON I Configuration and output current monitoring pin. Connect a resistor to ground to set the I2C address. Keep the total capacitance on this pin less than 200pF.
3 COMP O External compensation pin. This pin is the output of the transconductance amplifier. Connect a compensation network from the COMP pin to AGND.
4 nINT O Interrupt pin. This pin is an open-collector output that toggles low in case of a status register change.
5 AGND G Analog ground pin. Ground return for the internal voltage reference and analog circuits.
6 VDDA P Internal analog bias regulator output pin. Connect a 22μF ceramic decoupling capacitor from VDDA to AGND as close as possible to the pins.
7 VCC P VCC bias supply pin. Connect a 4.7μF ceramic capacitors between VCC and PGND as close as possible to the pins.
8 PGND G Controller power ground pin. Connect to the system ground.
9 LO O Low-side power MOSFET gate driver output.
10 VIN P Controller input pin to the VCC regulator. Connect to the input supply, input filter capacitors and drain of the high side FET. Place input capacitors close to VIN pin.
11 HO O High-side power MOSFET gate driver output.
12 CBOOT P High-side driver supply for the bootstrap gate drive. Connect a 47nF bootstrap capacitor between the CBOOT and SW pins.
13 SW P Switch node pin and the high-side gate driver return. Connect a 47nF bootstrap capacitor between the CBOOT and SW pins, the source terminal of the high-side MOSFET, and the drain terminal of the low-side MOSFET.
14 SCL I/O I2C clock pin.
15 SDA I/O I2C data pin.
16 PFM / SYNC I PFM / FPWM mode selection and synchronization input pin. Connect the PFM / SYNC pin to VDDA to enable diode emulation mode. Connect the PFM / SYNC pin to AGND to operate in forced PWM (FPWM) mode with continuous conduction at light loads. The PFM / SYNC pin can also be used as a synchronization input to synchronize the internal oscillator to an external clock.
17 EN / UVLO I Enable / undervoltage lockout pin. Drive this pin high to place the device into the ready mode. When in ready mode, the I2C interface is available and the controller can be enabled by setting the CONTROLLER_EN bit in the OPERATIONOPERATION register. If the EN/UVLO function is not needed, tie this pin to VIN. Connect an external resistor divider network to set the UVLO threshold.
18 ISNS+ I Current sense amplifier input. Connect the ISNS+ pin to the inductor side of the external current sense resistor using a low-current Kelvin connection.
19 VOUTS I Output voltage sense and the current sense amplifier input. Connect the VOUTS pin to the output side of the respective current sense resistor using a low-current Kelvin connection.
EP Exposed thermal pad. Connect to the system ground using multiple vias.
P = Power, G = Ground, I = Input, O = Output.