SLVSJL5B August   2025  – June 2026 CC2755P20

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram—RHA package
    2. 6.2 Signal Descriptions
      1. 6.2.1 Signal Descriptions—RHA Package
    3. 6.3 Connections for Unused Pins and Modules
      1. 6.3.1 Connections for Unused Pins and Modules—RHA Package
    4. 6.4 Peripheral Pin Mapping
      1. 6.4.1 RHA Peripheral Pin Mapping
    5. 6.5 Peripheral Signal Descriptions
      1. 6.5.1 RHA Peripheral Signal Descriptions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD and MSL Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DC/DC
    5. 7.5  GLDO
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  BATMON Temperature Sensor
    9. 7.9  Power Consumption—Power Modes
    10. 7.10 Power Consumption–Radio Modes (P variant)
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy—Receive (RX)
    15. 7.15 Bluetooth Low Energy—Transmit (TX)
    16. 7.16 Bluetooth Channel Sounding
    17. 7.17 Zigbee and Thread—IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - RX
    18. 7.18 Zigbee and Thread—IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps) - TX
    19. 7.19 2.4GHz RX/TX CW
    20. 7.20 Timing and Switching Characteristics
      1. 7.20.1 Reset Timing
      2. 7.20.2 Wakeup Timing
      3. 7.20.3 Clock Specifications
        1. 7.20.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.20.3.2 96MHz RC Oscillator (HFOSC)
        3. 7.20.3.3 80/90/98MHz RC Oscillator (AFOSC)
        4. 7.20.3.4 32kHz Crystal Oscillator (LFXT)
        5. 7.20.3.5 32kHz RC Oscillator (LFOSC)
    21. 7.21 Peripheral Characteristics
      1. 7.21.1 UART
        1. 7.21.1.1 UART Characteristics
      2. 7.21.2 SPI
        1. 7.21.2.1 SPI Characteristics
        2. 7.21.2.2 SPI Controller Mode
        3. 7.21.2.3 SPI Timing Diagrams—Controller Mode
        4. 7.21.2.4 SPI Peripheral Mode
        5. 7.21.2.5 SPI Timing Diagrams—Peripheral Mode
      3. 7.21.3 I2C
        1. 7.21.3.1 I2C Characteristics
        2. 7.21.3.2 I2C Timing Diagram
      4. 7.21.4 I2S
        1. 7.21.4.1 I2S Controller Mode
        2. 7.21.4.2 I2S Peripheral Mode
      5. 7.21.5 GPIO
        1. 7.21.5.1 GPIO DC Characteristics
      6. 7.21.6 ADC
        1. 7.21.6.1 Analog-to-Digital Converter (ADC) Characteristics
      7. 7.21.7 Comparators
        1. 7.21.7.1 Low Power Comparator
      8. 7.21.8 Voltage Glitch Monitor
    22. 7.22 Typical Characteristics
      1. 7.22.1 MCU Current
      2. 7.22.2 RX Current
      3. 7.22.3 TX Current
      4. 7.22.4 RX Performance
      5. 7.22.5 TX Performance
      6. 7.22.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
      2. 8.3.2 802.15.4 (Thread, Zigbee, Matter)
    4. 8.4  Memory
    5. 8.5  Hardware Security Module (HSM)
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Algorithm Processing Unit (APU)
    9. 8.9  Serial Peripherals and I/O
    10. 8.10 Battery and Temperature Monitor
    11. 8.11 Voltage Glitch Monitor (VGM)
    12. 8.12 µDMA
    13. 8.13 Debug
    14. 8.14 Power Management
    15. 8.15 Clock Systems
    16. 8.16 Network Processor
    17. 8.17 Integrated BALUN, High Power PA (Power Amplifier)
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
      2. 10.2.2 Software License and Notice
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

1 Features

Wireless MCU processing elements
  • Arm®Cortex®-M33 processor (96MHz) with FPU (floating point unit), TrustZone®-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth® Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
Wireless MCU memory
  • 2MB of in-system programmable flash
  • 288KB of SRAM
  • 36KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
MCU peripherals
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs have wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth® channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART
  • 2× SPI
  • 1× I2C
  • 1× I2S
Security enablers
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Secure boot root of trust (RoT)
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
Low-power consumption (VDDS at 3.3V)
  • On-chip buck DC/DC converter
  • RX current: 6.2mA
  • TX current at 0dBm: 7.7mA
  • TX current at +5dBm: 10.6mA
  • TX current at +20dBm: 132mA
  • Active mode MCU 96MHz (CoreMark®): 6.7mA
  • Standby: 1.1µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160.8nA
Wireless protocol support
  • Matter
  • Thread
  • Zigbee®
  • Bluetooth® Low Energy Core 6.0 Qualified with support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • Proprietary 2.4GHz systems
  • Multi-protocol
High-performance radio
  • 2.4GHz RF transceiver compatible with Bluetooth® Low Energy specification and IEEE 802.15.4 specification
  • Output power up to +10dBm (R version)
  • Output power up to +20dBm (P version)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • IEEE 802.15.4 (2.4GHz): –103dBm
    • Bluetooth® LE 125kbps: –103.5dBm
    • Bluetooth® LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
Development tools and software

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks