SLVSK21
October 2025
LMG708B0
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Device and Documentation Support
4.1
Device Support
4.1.1
Development Support
4.1.1.1
Custom Design With WEBENCH® Tools
4.2
Documentation Support
4.2.1
Related Documentation
4.2.1.1
Low-EMI Design Resources
4.2.1.2
Thermal Design Resources
4.2.1.3
PCB Layout Resources
4.3
Receiving Notification of Documentation Updates
4.4
Support Resources
4.5
Trademarks
4.6
Electrostatic Discharge Caution
4.7
Glossary
5
Mechanical, Packaging, and Orderable Information
5.1
Tape and Reel Information
4.2.1.2
Thermal Design Resources
Texas Instruments,
Improving Thermal Performance in High Ambient Temperature Environments With Thermally Enhanced Packaging
white paper
Applications notes:
Texas Instruments,
Thermal Design by Insight, Not Hindsight
Texas Instruments,
A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
Texas Instruments,
PowerPAD™
Thermally Enhanced Package
Texas Instruments,
Using New Thermal Metrics
Texas Instruments,
PowerPAD™ Made Easy
application brief