SLVSLQ9 July   2026 TXB0104W-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements: VCCA = 1.2 ± 0.1V
    7. 5.7  Timing Requirements: VCCA = 1.5V ± 0.1V
    8. 5.8  Timing Requirements: VCCA = 1.8V ± 0.15V
    9. 5.9  Timing Requirements: VCCA = 2.5V ± 0.2V
    10. 5.10 Timing Requirements: VCCA = 3.3V ± 0.3V
    11. 5.11 Switching Characteristics: VCCA = 1.2 ± 0.1V
    12. 5.12 Switching Characteristics: VCCA = 1.5V ± 0.1V
    13. 5.13 Switching Characteristics: VCCA = 1.8V ± 0.15V
    14. 5.14 Switching Characteristics: VCCA = 2.5V ± 0.2V
    15. 5.15 Switching Characteristics: VCCA = 3.3V ± 0.3V
    16. 5.16 Operating Characteristics
    17. 5.17 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Input Driver Requirements
      3. 7.3.3 Output Load Considerations
      4. 7.3.4 Enable and Disable
      5. 7.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.4.1 Layout Guidelines

To ensure reliability of the device, following common printed-circuit board layout guidelines are recommended:

  • Use bypass capacitors on power supplies. Place the bypass capacitors as close as possible to the VCCA, VCCB pin, and GND pin
  • Use short trace-lengths to avoid excessive loading.
  • PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than the one-shot duration, approximately 10ns, to verify that any reflection encounters low impedance at the source driver