SLVUBX1 December   2020 TPS63810

 

  1.   Trademarks
  2. 1Introduction
  3. 2Quick Start
    1. 2.1 Step 1: Software Installation
    2. 2.2 Step 2: Firmware Completition and Flashing
    3. 2.3 Step 3: Hardware Setup
    4. 2.4 Step 4: GUI
  4. 3System Overview
  5. 4Hardware Overview
    1. 4.1 Buck-Boost Converter
    2. 4.2 Thermoelectric Cooler (TEC)
    3. 4.3 LaunchPad
    4. 4.4 Voltage Reference
    5. 4.5 Temperature Sensor
  6. 5Firmware Overview
  7. 6Graphical User Interface (GUI)
  8. 7Setup Details
  9. 8Bill of Materials, PCB Layout, and Schematic
    1. 8.1 Bill of Materials
    2. 8.2 PCB Layout
    3. 8.3 Schematic

Schematic

Figure 8-4 shows the BOOSTXL-TECDRV schematic. Note that some lines can be connected to different pins on the BoosterPack header. This is done so that the BoosterPack can be used with other TI LaunchPads. For example, the A_IN line used to interface the analog temperature sensor to the ADC on the LaunchPad is connected to the header pin BP6 via jumper resistor R14. If needed, this line can be re-routed to BP2 or BP26 pins of the BoosterPack header by removing R14 and populating R15 or R16 jumper resistors.

GUID-20200909-CA0I-6G2Z-J8DJ-NMBHSVTSQ44B-low.gif Figure 8-4 BOOSTXL-TECDRV Schematic