SLVUD25 April   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Setup
    3. 2.3 Header Information
    4. 2.4 Jumper Information
    5. 2.5 Interfaces
  9. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  10. 4Additional Information
    1. 4.1 Known Hardware or Software Issues
    2. 4.2 Trademarks

PCB Layouts

TPS26742EQ1EVM Top Layer
                        Composite Figure 3-13 Top Layer Composite
TPS26742EQ1EVM Bottom Layer
                        Composite Figure 3-14 Bottom Layer Composite
TPS26742EQ1EVM Top Layer Mask Figure 3-15 Top Layer Mask
TPS26742EQ1EVM Bottom Layer Mask Figure 3-16 Bottom Layer Mask
TPS26742EQ1EVM Top Layer Figure 3-17 Top Layer
TPS26742EQ1EVM Layer 2 (GND) Figure 3-18 Layer 2 (GND)
TPS26742EQ1EVM Layer 3 (SIG) Figure 3-19 Layer 3 (SIG)
TPS26742EQ1EVM Layer 4 (SIG) Figure 3-20 Layer 4 (SIG)
TPS26742EQ1EVM Layer 5 (GND) Figure 3-21 Layer 5 (GND)
TPS26742EQ1EVM Bottom Layer Figure 3-22 Bottom Layer
TPS26742EQ1EVM Board Level
                        Dimensions Figure 3-23 Board Level Dimensions