SLVUD25
April 2025
1
Description
Get Started
Features
Applications
6
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specification
1.4
Device Information
2
Hardware
2.1
Power Requirements
2.2
Setup
2.3
Header Information
2.4
Jumper Information
2.5
Interfaces
3
Hardware Design Files
3.1
Schematics
3.2
PCB Layouts
3.3
Bill of Materials (BOM)
4
Additional Information
4.1
Known Hardware or Software Issues
4.2
Trademarks
3.2
PCB Layouts
Figure 3-13
Top Layer Composite
Figure 3-14
Bottom Layer Composite
Figure 3-15
Top Layer Mask
Figure 3-16
Bottom Layer Mask
Figure 3-17
Top Layer
Figure 3-18
Layer 2 (GND)
Figure 3-19
Layer 3 (SIG)
Figure 3-20
Layer 4 (SIG)
Figure 3-21
Layer 5 (GND)
Figure 3-22
Bottom Layer
Figure 3-23
Board Level Dimensions