SLVUD81 April   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Test Setup
    2. 2.2 Modification
    3. 2.3 Input Capacitor C1
  7. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
    3. 3.3 Bill of Materials
  8. 4Additional Information
    1.     Trademarks

3.2 PCB Layout

The TPS61372LEVM board is a 4-layer, 2/1/1/2oz copper thick PCB. All the components are placed on the top layer. Figure 3-2, Figure 3-3, Figure 3-4and Figure 3-5 show the top view, signal layer 1, signal layer 2 and bottom view, respectively.

TPS61372LEVM-110 Top Layer LayoutFigure 3-2 Top Layer Layout
TPS61372LEVM-110 Signal Layer 1 LayoutFigure 3-3 Signal Layer 1 Layout
TPS61372LEVM-110 Signal Layer 2 LayoutFigure 3-4 Signal Layer 2 Layout
TPS61372LEVM-110 Bottom Layer Layout (Mirrored)Figure 3-5 Bottom Layer Layout (Mirrored)