SLVUD91 April   2025 TPS7H4011-SEP

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Setup
      1. 2.1.1 Jumper Configuration
      2. 2.1.2 Transient Load Circuit
    2. 2.2 Connector Descriptions
    3. 2.3 Best Practices
  7. 3Implementation Results
    1. 3.1 Default Configuration Results
    2. 3.2 Soft Startup
    3. 3.3 Voltage Ripple on VOUT
    4. 3.4 Load Step
    5. 3.5 Frequency Response
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  9. 5Compliance Information
    1. 5.1 Compliance and Certifications
  10. 6Additional Information
    1. 6.1 Trademarks
  11. 7Related Documentation

PCB Layouts

TPS7H4011EVM Top OverlayFigure 4-2 Top Overlay
TPS7H4011EVM Top Solder MaskFigure 4-3 Top Solder Mask
TPS7H4011EVM Layer 1 (Top)Figure 4-4 Layer 1 (Top)
TPS7H4011EVM Layer 2Figure 4-5 Layer 2
TPS7H4011EVM Layer 3Figure 4-6 Layer 3
TPS7H4011EVM Layer 4Figure 4-7 Layer 4
TPS7H4011EVM Layer 5Figure 4-8 Layer 5
TPS7H4011EVM Layer 6Figure 4-9 Layer 6
TPS7H4011EVM Layer 7Figure 4-10 Layer 7
TPS7H4011EVM Layer 8 (Bottom)Figure 4-11 Layer 8 (Bottom)
TPS7H4011EVM Bottom Solder MaskFigure 4-12 Bottom Solder Mask
TPS7H4011EVM Bottom OverlayFigure 4-13 Bottom Overlay
TPS7H4011EVM Drill DrawingFigure 4-14 Drill Drawing