SLVUDD2 December   2025

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 EVM Marking
    2. 2.2 Power Requirements
    3. 2.3 Setup
      1. 2.3.1 TI Demo Set Up
      2. 2.3.2 External MCU - Launch-pad Based Set Up
    4. 2.4 Header Information
      1. 2.4.1 SPI Header
      2. 2.4.2 Booster-pack Header
    5. 2.5 Jumper Information
    6. 2.6 Push Buttons
    7. 2.7 Interfaces
    8. 2.8 uDFP Patch Update
  9. 3Software
    1. 3.1 Software Description
  10. 4Implementation Results
    1. 4.1 Evaluation Setup
    2. 4.2 Performance Data and Results
  11. 5Hardware Design Files
    1. 5.1 Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  12. 6Related Documentation

2.5 Jumper Information

VCC_MODULE To provide core (VCC) power to Module any of solder jumper J1 or header jupmer J16 needs to be closed.

VCC_IO_MODULE To provide IO power to Module any of solder jumper J4 or header jumper J20 needs to closed.

Note: In the EVM, by default J1 and J4 are closed