SLVUDF9 October   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
      1. 3.2.1 PCB Stack-Up and Material
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1.     Trademarks

3.2 PCB Layouts

Figure 3-4 through Figure 3-7 illustrate the PCB layers for this EVM.

TRF3302EVM Top LayerFigure 3-4 Top Layer
TRF3302EVM Layer 2Figure 3-5 Layer 2
TRF3302EVM Layer 3Figure 3-6 Layer 3
TRF3302EVM Bottom LayerFigure 3-7 Bottom Layer