SLVUDF9 October   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
      1. 3.2.1 PCB Stack-Up and Material
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1.     Trademarks

3.2.1 PCB Stack-Up and Material

The EVM board dimensions are 1300 mil by 1070 mil, thickness is 60.5-mil, 4-layer board with material type Isola® 370HR as shown in Figure 3-8. The top layer routes the power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground layer. The signal trace impedance is targeted at nominal 50Ω. The bottom three layers are ground layers.

TRF3302EVM EVM Stack-Up (Units in Mils) Figure 3-8 EVM Stack-Up (Units in Mils)