SLVUDH6 September   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Replace U1: Solder reflow
    3. 1.3 Replace R1:
    4. 1.4 Kit Contents
    5. 1.5 Specification
    6. 1.6 Device Information
  7. 2Hardware
    1. 2.1 Additional Images
    2. 2.2 Power Requirements
    3. 2.3 Recommended Test Equipment
    4. 2.4 Setup
    5. 2.5 External Connections for Easy Evaluation
    6. 2.6 Test Points
    7. 2.7 Oscilloscope Probes: Probing the EVM
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 PCB Layout Guidelines
    4. 3.4 PCB Layout Example
    5. 3.5 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks

3.4 PCB Layout Example

The PCB layout example, highlighted in the following figures, is based on the EVM schematic shown in Figure 3‑1 and PCB layer images shown in Figure 3‑4 to Figure 3‑7.

UCC35341-Q1, UCC34141EVM-116 VIN (C2, C3) and VDD (C5, C8) Capacitors Figure 3-8 VIN (C2, C3) and VDD (C5, C8) Capacitors
UCC35341-Q1, UCC34141EVM-116 FBVDD (R6-7, C6), FBVEE (R5, C4), COMA Routing Figure 3-9 FBVDD (R6-7, C6), FBVEE (R5, C4), COMA Routing
UCC35341-Q1, UCC34141EVM-116 Thermal Vias Figure 3-10 Thermal Vias
UCC35341-Q1, UCC34141EVM-116 Isolation Keep Out Region Figure 3-11 Isolation Keep Out Region
UCC35341-Q1, UCC34141EVM-116 Bottom Side, Buck Boost, VEE LC Placement and Routing Figure 3-12 Bottom Side, Buck Boost, VEE LC Placement and Routing
UCC35341-Q1, UCC34141EVM-116 Top Side, Component Placement and Routing Figure 3-13 Top Side, Component Placement and Routing