SLVUDH6 September   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Replace U1: Solder reflow
    3. 1.3 Replace R1:
    4. 1.4 Kit Contents
    5. 1.5 Specification
    6. 1.6 Device Information
  7. 2Hardware
    1. 2.1 Additional Images
    2. 2.2 Power Requirements
    3. 2.3 Recommended Test Equipment
    4. 2.4 Setup
    5. 2.5 External Connections for Easy Evaluation
    6. 2.6 Test Points
    7. 2.7 Oscilloscope Probes: Probing the EVM
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 PCB Layout Guidelines
    4. 3.4 PCB Layout Example
    5. 3.5 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks

3.2 PCB Layouts

The UCC34141EVM-116 is designed using a four-layer, FR4, PCB, fabricated with 2-ounce copper on all four layers. The EVM, PCB demonstrates the important use of ground planes and tented stitching vias for shielding and improving EMI performance. For higher density PCBs such as automotive traction inverters, the PCB can include several additional signal layers but similar design methodology can be applied as best as possible.

UCC35341-Q1, UCC34141EVM-116 Fully Assembled 3D Top View Figure 3-2 Fully Assembled 3D Top View
UCC35341-Q1, UCC34141EVM-116 Fully Assembled 3D Bottom View Figure 3-3 Fully Assembled 3D Bottom View
UCC35341-Q1, UCC34141EVM-116 PCB Top Layer, Assembly Figure 3-4 PCB Top Layer, Assembly
UCC35341-Q1, UCC34141EVM-116 Ground Layer 2 Figure 3-5 Ground Layer 2
UCC35341-Q1, UCC34141EVM-116 Ground Layer 3 Figure 3-6 Ground Layer 3
UCC35341-Q1, UCC34141EVM-116 PCB Bottom Layer, Assembly (mirrored view) Figure 3-7 PCB Bottom Layer, Assembly (mirrored view)