SLYS053C November 2023 – May 2025 TMAG3001
PRODUCTION DATA
| THERMAL METRIC(1) | TMAG3001 | UNIT | |
|---|---|---|---|
| YBG (WCSP) | |||
| 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 131.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 1.4 | °C/W |
| RθJC(bottom) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |
| RθJB | Junction-to-board thermal resistance | 36.4 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.3 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 36.4 | °C/W |