SNAS818C July 2021 – August 2025 CDCDB800
PRODUCTION DATA
Figure 9-5 through Figure 9-7 are printed circuit board (PCB) layout examples that show the application of thermal design practices and a low-inductance ground connection between the device DAP and the PCB.
Figure 9-5 PCB
Layout Example for CDCDB800, Top layer
Figure 9-6 PCB
Layout Example for CDCDB800, GND Layer
Figure 9-7 PCB
Layout Example for CDCDB800, Bottom Layer