SNAS833B November   2021  – August 2025 CDCDB400

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Fail-Safe Input
      2. 7.3.2 Output Enable Control
      3. 7.3.3 SMBus
        1. 7.3.3.1 SMBus Address Assignment
    4. 7.4 Device Functional Modes
      1. 7.4.1 CKPWRGD_PD# Function
      2. 7.4.2 OE[3:0]# and SMBus Output Enables
      3. 7.4.3 Output Slew Rate Control
      4. 7.4.4 Output Impedance Control
    5. 7.5 Programming
  9. 8 Register Maps
    1. 8.1 CDCDB400 Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Enable Control Method
        2. 9.2.2.2 SMBus Address
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 TICS Pro
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

1 Features

  • 4 LP-HCSL outputs with programmable integrated 85Ω (default) or 100Ω differential output terminations
  • 4 hardware output enable (OE#) controls

  • Additive phase jitter after PCIE Gen 7 filter: 11.3fs, RMS (maximum)

  • Additive phase jitter after PCIE Gen 6 filter: 16.1fs, RMS (maximum)
  • Additive phase jitter after PCIE Gen 5 filter: 25fs, RMS (maximum)
  • Additive phase jitter after DB2000Q filter: 38fs, RMS (maximum)
  • Supports Common Clock (CC) and Individual Reference (IR) architectures
    • Spread spectrum-compatible
  • Output-to-output skew: < 50ps
  • Input-to-output delay: < 3ns

  • Fail-safe input

  • Programmable output slew rate control

  • 3 selectable SMBus addresses

  • 3.3V core and IO supply voltages
  • Hardware-controlled low power mode (PD#)
  • Current consumption: 46mA maximum
  • 5mm × 5mm, 32-pin VQFN package