SNAS890A
February 2025 – June 2025
HDC3120-Q1
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Device Power-Up
7.3.2
Device Disable and Enable
7.3.3
Conversion of the Signal Output
7.3.3.1
Relative Humidity (RH%) Measurement
7.3.3.2
Temperature Measurement
7.3.4
NIST Traceability and Unique ID
7.3.5
Output Short Circuit Protection
7.4
Device Functional Modes
7.4.1
On-Chip Heater
7.4.1.1
Operating Principle
7.4.1.1.1
Heater Configuration Example
7.4.1.2
Heater Electrical Behavior
7.4.1.3
Heater Temperature Increase
7.4.1.4
Heater Usage Guidelines
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
8.5
Storage and PCB Assembly
8.5.1
Storage and Handling
8.5.2
Product Storage
8.5.3
PCB Assembly Flow
8.5.4
Rework Consideration
8.5.5
Sensitivity to Chemicals and Vapors
8.5.6
Exposure to High Temperature and High Humidity Conditions
8.5.7
Recovering Sensor Performance: Bake and Rehydration Procedure
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
6.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per AEC Q100-002
(1)
±2000
V
Charged device model (CDM), per AEC Q100-011
±750
(1)
AEC Q100-002 indicates that HBM stressing must be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.