SNAS935B March   2025  – November 2025 CDC6C-Q1

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Device Comparison
6. 5 Pin Configuration and Functions
7. 6 Specifications
   1. 6.1 Absolute Maximum Ratings
   2. 6.2 ESD Ratings
   3. 6.3 Environmental Compliance
   4. 6.4 Recommended Operating Conditions
   5. 6.5 Thermal Information
   6. 6.6 Electrical Characteristics
   7. 6.7 Timing Diagrams
   8. 6.8 Typical Characteristics
8. 7 Parameter Measurement Information
   1. 7.1 Device Output Configurations
9. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1  Bulk Acoustic Wave (BAW)
      2. 8.3.2  Device Block-Level Description
      3. 8.3.3  Function Pin
      4. 8.3.4  Clock Output Interfacing and Termination
      5. 8.3.5  CDC6Cx-Q1 CISPR25 Radiated Emission Performance
         1. 8.3.5.1 EMI Reduction and Slow Mode Options
      6. 8.3.6  Temperature Stability
      7. 8.3.7  Frequency Aging
      8. 8.3.8  Mechanical Robustness
      9. 8.3.9  Wettable Flanks
      10. 8.3.10 Device Functional Modes
10. 9 Application and Implementation
    1. 9.1 Application Information
       1. 9.1.1 Driving Multiple Loads With a Single CDC6Cx-Q1
    2. 9.2 Typical Application
       1. 9.2.1 Design Requirements
       2. 9.2.2 Detailed Design Procedure
       3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
       1. 9.4.1 Layout Guidelines
          1. 9.4.1.1 Providing Thermal Reliability
          2. 9.4.1.2 Recommended Solder Reflow Profile
       2. 9.4.2 Layout Examples
11. 10Device and Documentation Support
    1. 10.1 Documentation Support
       1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
12. 11Revision History
13. 12Mechanical, Packaging, and Orderable Information

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 

Copyright © 2025, Texas Instruments Incorporated