SNLS504G October   2015  – June 2026 DP83867CS , DP83867E , DP83867IS

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
    1. 5.1 Unused Pins
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Power-Up Timing
    7. 6.7  Reset Timing
    8. 6.8  MII Serial Management Timing
    9. 6.9  SGMII Timing
    10. 6.10 RGMII Timing
    11. 6.11 DP83867E Start of Frame Detection Timing
    12. 6.12 DP83867IS/CS Start of Frame Detection Timing
    13. 6.13 Timing Diagrams
    14. 6.14 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 WoL (Wake-on-LAN) Packet Detection
        1. 7.3.1.1 Magic Packet Structure
        2. 7.3.1.2 Magic Packet Example
        3. 7.3.1.3 Wake-on-LAN Configuration and Status
      2. 7.3.2 Start of Frame Detect for IEEE 1588 Time Stamp
        1. 7.3.2.1 SFD Latency Variation and Determinism
          1. 7.3.2.1.1 1000Mb SFD Variation in Leader Mode
          2. 7.3.2.1.2 1000Mb SFD Variation in Follower Mode
          3. 7.3.2.1.3 100Mb SFD Variation
      3. 7.3.3 Clock Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 MAC Interfaces
        1. 7.4.1.1 Serial GMII (SGMII)
        2. 7.4.1.2 Reduced GMII (RGMII)
          1. 7.4.1.2.1 1000Mbps Mode Operation
          2. 7.4.1.2.2 1000Mbps Mode Timing
          3. 7.4.1.2.3 10Mbps and 100Mbps Mode
      2. 7.4.2 Serial Management Interface
        1. 7.4.2.1 Extended Address Space Access
          1. 7.4.2.1.1 Write Address Operation
          2. 7.4.2.1.2 Read Address Operation
          3. 7.4.2.1.3 Write (No Post Increment) Operation
          4. 7.4.2.1.4 Read (No Post Increment) Operation
          5. 7.4.2.1.5 Write (Post Increment) Operation
          6. 7.4.2.1.6 Read (Post Increment) Operation
          7. 7.4.2.1.7 Example of Read Operation Using Indirect Register Access
          8. 7.4.2.1.8 Example of Write Operation Using Indirect Register Access
      3. 7.4.3 Auto-Negotiation
        1. 7.4.3.1 Speed and Duplex Selection - Priority Resolution
        2. 7.4.3.2 Leader and Follower Resolution
        3. 7.4.3.3 Pause and Asymmetrical Pause Resolution
        4. 7.4.3.4 Next Page Support
        5. 7.4.3.5 Parallel Detection
        6. 7.4.3.6 Restart Auto-Negotiation
        7. 7.4.3.7 Enabling Auto-Negotiation Through Software
        8. 7.4.3.8 Auto-Negotiation Complete Time
        9. 7.4.3.9 Auto-MDIX Resolution
      4. 7.4.4 Loopback Mode
        1. 7.4.4.1 Near-End Loopback
          1. 7.4.4.1.1 MII Loopback
          2. 7.4.4.1.2 PCS Loopback
          3. 7.4.4.1.3 Digital Loopback
          4. 7.4.4.1.4 Analog Loopback
        2. 7.4.4.2 External Loopback
        3. 7.4.4.3 Far-End (Reverse) Loopback
      5. 7.4.5 BIST Configuration
      6. 7.4.6 Cable Diagnostics
        1. 7.4.6.1 TDR
        2. 7.4.6.2 Energy Detect
        3. 7.4.6.3 Fast Link Drop (FLD)
        4. 7.4.6.4 Fast Link Detect
        5. 7.4.6.5 Speed Optimization
        6. 7.4.6.6 Mirror Mode
        7. 7.4.6.7 Interrupt
        8. 7.4.6.8 IEEE 802.3 Test Modes
    5. 7.5 Programming
      1. 7.5.1 Strap Configuration
      2. 7.5.2 LED Configuration
      3. 7.5.3 LED Operation From 1.8V I/O VDD Supply
      4. 7.5.4 PHY Address Configuration
      5. 7.5.5 Reset Operation
        1. 7.5.5.1 Hardware Reset
        2. 7.5.5.2 IEEE Software Reset
        3. 7.5.5.3 Global Software Reset
        4. 7.5.5.4 Global Software Restart
        5. 7.5.5.5 PCS Restart
      6. 7.5.6 Power-Saving Modes
        1. 7.5.6.1 IEEE Power Down
        2. 7.5.6.2 Deep Power-Down Mode
        3. 7.5.6.3 Active Sleep
        4. 7.5.6.4 Passive Sleep
  9. Registers
    1.     99
      1. 8.1.1   Basic Mode Control Register (BMCR)
      2. 8.1.2   Basic Mode Status Register (BMSR)
      3. 8.1.3   PHY Identifier Register #1 (PHYIDR1)
      4. 8.1.4   PHY Identifier Register #2 (PHYIDR2)
      5. 8.1.5   Auto-Negotiation Advertisement Register (ANAR)
      6. 8.1.6   Auto-Negotiation Link Partner Ability Register (ANLPAR) (BASE Page)
      7. 8.1.7   Auto-Negotiate Expansion Register (ANER)
      8. 8.1.8   Auto-Negotiation Next Page Transmit Register (ANNPTR)
      9. 8.1.9   Auto-Negotiation Next Page Receive Register (ANNPRR)
      10. 8.1.10  1000BASE-T Configuration Register (CFG1)
      11. 8.1.11  Status Register 1 (STS1)
      12. 8.1.12  Extended Register Addressing
        1. 8.1.12.1 Register Control Register (REGCR)
        2. 8.1.12.2 Address or Data Register (ADDAR)
      13. 8.1.13  1000BASE-T Status Register (1KSCR)
      14. 8.1.14  PHY Control Register (PHYCR)
      15. 8.1.15  PHY Status Register (PHYSTS)
      16. 8.1.16  MII Interrupt Control Register (MICR)
      17. 8.1.17  Interrupt Status Register (ISR)
      18. 8.1.18  Configuration Register 2 (CFG2)
      19. 8.1.19  Receiver Error Counter Register (RECR)
      20. 8.1.20  BIST Control Register (BISCR)
      21. 8.1.21  Status Register 2 (STS2)
      22. 8.1.22  LED Configuration Register 1 (LEDCR1)
      23. 8.1.23  LED Configuration Register 2 (LEDCR2)
      24. 8.1.24  LED Configuration Register (LEDCR3)
      25. 8.1.25  Configuration Register 3 (CFG3)
      26. 8.1.26  Control Register (CTRL)
      27. 8.1.27  Testmode Channel Control (TMCH_CTRL)
      28. 8.1.28  Robust Auto MDIX Timer Configuration Register (AMDIX_TMR_CFG)
      29. 8.1.29  Fast Link Drop Configuration Register (FLD_CFG)
      30. 8.1.30  Fast Link Drop Threshold Configuration Register (FLD_THR_CFG)
      31. 8.1.31  Configuration Register 4 (CFG4)
      32. 8.1.32  RGMII Control Register (RGMIICTL)
      33. 8.1.33  RGMII Control Register 2 (RGMIICTL2)
      34. 8.1.34  SGMII Auto-Negotiation Status (SGMII_ANEG_STS)
      35. 8.1.35  100BASE-TX Configuration (100CR)
      36. 8.1.36  Viterbi Module Configuration (VTM_CFG)
      37. 8.1.37  Skew FIFO Status (SKEW_FIFO)
      38. 8.1.38  Strap Configuration Status Register 1 (STRAP_STS1)
      39. 8.1.39  Strap Configuration Status Register 2 (STRAP_STS2)
      40. 8.1.40  BIST Control and Status Register 1 (BICSR1)
      41. 8.1.41  BIST Control and Status Register 2 (BICSR2)
      42. 8.1.42  BIST Control and Status Register 3 (BICSR3)
      43. 8.1.43  BIST Control and Status Register 4 (BICSR4)
      44. 8.1.44  Configuration for Receiver's Equalizer (CRE)
      45. 8.1.45  RGMII Delay Control Register (RGMIIDCTL)
      46. 8.1.46  ANA_LD_TXG_FINE_GAINSEL_AB (ALTFGAB)
      47. 8.1.47  ANA_LD_TXG_FINE_GAINSEL_CD (ALTFGCD)
      48. 8.1.48  ANA_LD_FILTER_TUNE_AB (ALFTAB)
      49. 8.1.49  ANA_LD_FILTER_TUNE_CD (ALFTCD)
      50. 8.1.50  Configuration of Receiver's LPF (CRLPF)
      51. 8.1.51  Enable Control of Receiver's Equalizer (ECRE)
      52. 8.1.52  PLL Clock-out Control Register (PLLCTL)
      53. 8.1.53  SGMII Control Register 1 (SGMIICTL1)
      54. 8.1.54  Transmitter Control Register (ANA_LD_DATA_CTRL)
      55. 8.1.55  DSP Configuration Register 3 (DSP_CFG3)
      56. 8.1.56  Sync FIFO Control (SYNC_FIFO_CTRL)
      57. 8.1.57  DSP Hybrid Configuration Register 2 (DSP_HYBRID_CFG2)
      58. 8.1.58  Loopback Configuration Register (LOOPCR)
      59. 8.1.59  DSP Configuration (DSP_CONFIG)
      60. 8.1.60  DSP Select Register 0 (DSP_SEL0)
      61. 8.1.61  DSP Select Register 1 (DSP_SEL1)
      62. 8.1.62  DSP Select Register 2 (DSP_SEL2)
      63. 8.1.63  DSP Follower Select Register 0 (DSP_FLR_SEL0)
      64. 8.1.64  DSP Follower Select Register 3 (DSP_FLR_SEL3)
      65. 8.1.65  DSP Follower Timing Loop Register 1 (DSP_FLR_TLOOP1)
      66. 8.1.66  DSP Follower Timing Loop Register 2 (DSP_FLR_TLOOP2)
      67. 8.1.67  DSP Feedforward Equalizer Configuration (DSP_FFE_CFG)
      68. 8.1.68  Receive Configuration Register (RXFCFG)
      69. 8.1.69  Receive Status Register (RXFSTS)
      70. 8.1.70  Pattern Match Data Register 1 (RXFPMD1)
      71. 8.1.71  Pattern Match Data Register 2 (RXFPMD2)
      72. 8.1.72  Pattern Match Data Register 3 (RXFPMD3)
      73. 8.1.73  SecureOn Pass Register 2 (RXFSOP1)
      74. 8.1.74  SecureOn Pass Register 2 (RXFSOP2)
      75. 8.1.75  SecureOn Pass Register 3 (RXFSOP3)
      76. 8.1.76  Receive Pattern Register 1 (RXFPAT1)
      77. 8.1.77  Receive Pattern Register 2 (RXFPAT2)
      78. 8.1.78  Receive Pattern Register 3 (RXFPAT3)
      79. 8.1.79  Receive Pattern Register 4 (RXFPAT4)
      80. 8.1.80  Receive Pattern Register 5 (RXFPAT5)
      81. 8.1.81  Receive Pattern Register 6 (RXFPAT6)
      82. 8.1.82  Receive Pattern Register 7 (RXFPAT7)
      83. 8.1.83  Receive Pattern Register 8 (RXFPAT8)
      84. 8.1.84  Receive Pattern Register 9 (RXFPAT9)
      85. 8.1.85  Receive Pattern Register 10 (RXFPAT10)
      86. 8.1.86  Receive Pattern Register 11 (RXFPAT11)
      87. 8.1.87  Receive Pattern Register 12 (RXFPAT12)
      88. 8.1.88  Receive Pattern Register 13 (RXFPAT13)
      89. 8.1.89  Receive Pattern Register 14 (RXFPAT14)
      90. 8.1.90  Receive Pattern Register 15 (RXFPAT15)
      91. 8.1.91  Receive Pattern Register 16 (RXFPAT16)
      92. 8.1.92  Receive Pattern Register 17 (RXFPAT17)
      93. 8.1.93  Receive Pattern Register 18 (RXFPAT18)
      94. 8.1.94  Receive Pattern Register 19 (RXFPAT19)
      95. 8.1.95  Receive Pattern Register 20 (RXFPAT20)
      96. 8.1.96  Receive Pattern Register 21 (RXFPAT21)
      97. 8.1.97  Receive Pattern Register 22 (RXFPAT22)
      98. 8.1.98  Receive Pattern Register 23 (RXFPAT23)
      99. 8.1.99  Receive Pattern Register 24 (RXFPAT24)
      100. 8.1.100 Receive Pattern Register 25 (RXFPAT25)
      101. 8.1.101 Receive Pattern Register 26 (RXFPAT26)
      102. 8.1.102 Receive Pattern Register 27 (RXFPAT27)
      103. 8.1.103 Receive Pattern Register 28 (RXFPAT28)
      104. 8.1.104 Receive Pattern Register 29 (RXFPAT29)
      105. 8.1.105 Receive Pattern Register 30 (RXFPAT30)
      106. 8.1.106 Receive Pattern Register 31 (RXFPAT31)
      107. 8.1.107 Receive Pattern Register 32 (RXFPAT32)
      108. 8.1.108 Receive Pattern Byte Mask Register 1 (RXFPBM1)
      109. 8.1.109 Receive Pattern Byte Mask Register 2 (RXFPBM2)
      110. 8.1.110 Receive Pattern Byte Mask Register 3 (RXFPBM3)
      111. 8.1.111 Receive Pattern Byte Mask Register 4 (RXFPBM4)
      112. 8.1.112 Receive Pattern Control (RXFPATC)
      113. 8.1.113 10M SGMII Configuration (10M_SGMII_CFG)
      114. 8.1.114 I/O Configuration (IO_MUX_CFG)
      115. 8.1.115 GPIO Mux Control Register (GPIO_MUX_CTRL)
      116. 8.1.116 TDR General Configuration Register 1 (TDR_GEN_CFG1)
      117. 8.1.117 TDR Threshold Configuration Register 1 (TDR_THR_CFG1)
      118. 8.1.118 TDR Threshold Configuration Register 2 (TDR_THR_CFG2)
      119. 8.1.119 TDR General Configuration Register 5 (TDR_GEN_CFG5)
      120. 8.1.120 TDR Peak Locations Register 1 (TDR_PEAKS_LOC_1)
      121. 8.1.121 TDR Peak Locations Register 2 (TDR_PEAKS_LOC_2)
      122. 8.1.122 TDR Peak Locations Register 3 (TDR_PEAKS_LOC_3)
      123. 8.1.123 TDR Peak Locations Register 4 (TDR_PEAKS_LOC_4)
      124. 8.1.124 TDR Peak Locations Register 5 (TDR_PEAKS_LOC_5)
      125. 8.1.125 TDR Peak Locations Register 6 (TDR_PEAKS_LOC_6)
      126. 8.1.126 TDR Peak Locations Register 7 (TDR_PEAKS_LOC_7)
      127. 8.1.127 TDR Peak Locations Register 8 (TDR_PEAKS_LOC_8)
      128. 8.1.128 TDR Peak Locations Register 9 (TDR_PEAKS_LOC_9)
      129. 8.1.129 TDR Peak Locations Register 10 (TDR_PEAKS_LOC_10)
      130. 8.1.130 TDR Peak Amplitudes Register 1 (TDR_PEAKS_AMP_1)
      131. 8.1.131 TDR Peak Amplitudes Register 2 (TDR_PEAKS_AMP_2)
      132. 8.1.132 TDR Peak Amplitudes Register 3 (TDR_PEAKS_AMP_3)
      133. 8.1.133 TDR Peak Amplitudes Register 4 (TDR_PEAKS_AMP_4)
      134. 8.1.134 TDR Peak Amplitudes Register 5 (TDR_PEAKS_AMP_5)
      135. 8.1.135 TDR Peak Amplitudes Register 6 (TDR_PEAKS_AMP_6)
      136. 8.1.136 TDR Peak Amplitudes Register 7 (TDR_PEAKS_AMP_7)
      137. 8.1.137 TDR Peak Amplitudes Register 8 (TDR_PEAKS_AMP_8)
      138. 8.1.138 TDR Peak Amplitudes Register 9 (TDR_PEAKS_AMP_9)
      139. 8.1.139 TDR Peak Amplitudes Register 10 (TDR_PEAKS_AMP_10)
      140. 8.1.140 TDR General Status (TDR_GEN_STATUS)
      141. 8.1.141 TDR Peak Sign AB (TDR_PEAK_SIGN_A_B)
      142. 8.1.142 TDR Peak Sign CD (TDR_PEAK_SIGN_C_D)
      143. 8.1.143 DSP Leader Step 4 Register (DSP_LDR_STEP4)
      144. 8.1.144 DSP Follower Step 4 Register (DSP_FLR_STEP4)
      145. 8.1.145 DSP Follower Step 5 Register (DSP_FLR_STEP5)
      146. 8.1.146 DSP Follower Step 6&7 Register (DSP_FLR_STEP67)
      147. 8.1.147 Programmable Gain Register (PROG_GAIN)
      148. 8.1.148 MMD3 PCS Control Register (MMD3_PCS_CTRL)
      149. 8.1.149 Mean Square Error Channel A Register (MSE_A)
      150. 8.1.150 Mean Square Error Channel B Register (MSE_B)
      151. 8.1.151 Mean Square Error Channel C Register (MSE_C)
      152. 8.1.152 Mean Square Error Channel D Register (MSE_D)
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Cable Line Driver
        2. 9.2.1.2 Clock In (XI) Recommendation
        3. 9.2.1.3 Crystal Recommendations
        4. 9.2.1.4 Clock Out (CLK_OUT) Phase Noise
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 MAC Interface
          1. 9.2.2.1.1 SGMII Layout Guidelines
          2. 9.2.2.1.2 RGMII Layout Guidelines
        2. 9.2.2.2 Media Dependent Interface (MDI)
          1. 9.2.2.2.1 MDI Layout Guidelines
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Signal Traces
        2. 9.4.1.2 Return Path
        3. 9.4.1.3 Transformer Layout
        4. 9.4.1.4 Metal Pour
        5. 9.4.1.5 PCB Layer Stacking
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Pin Configuration and Functions

DP83867CS DP83867IS DP83867E RGZ Package48-Pin VQFNTop ViewFigure 5-1 RGZ Package
48-Pin VQFN
Top View
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
MAC INTERFACES (SGMII, RGMII)
TX_D3 25 I, PD TRANSMIT DATA Bit 3: This signal carries data from the MAC to the PHY in RGMII mode. This pin is synchronous to the transmit clock GTX_CLK.
TX_D2 26 I, PD TRANSMIT DATA Bit 2: This signal carries data from the MAC to the PHY in RGMII mode. This pin is synchronous to the transmit clock GTX_CLK.
SGMII_SIP 27 I, PD Differential SGMII Data Input: This signal carries data from the MAC to the PHY in SGMII mode. This pin is synchronous to the differential SGMII clock input.
This pin can be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
TX_D1 27 I, PD TRANSMIT DATA Bit 1: This signal carries data from the MAC to the PHY in RGMII mode. This pin is synchronous to the transmit clock GTX_CLK.
SGMII_SIN 28 I, PD Differential SGMII Data Input: This signal carries data from the MAC to the PHY in SGMII mode. This pin is synchronous to the differential SGMII clock input.
This pin can be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
TX_D0 28 I, PD TRANSMIT DATA Bit 0: This signal carries data from the MAC to the PHY in RGMII mode. This pin is synchronous to the transmit clock GTX_CLK.
GTX_CLK 29 I, PD RGMII TRANSMIT CLOCK: This continuous clock signal is sourced from the MAC layer to the PHY. Nominal frequency is 125MHz.
RX_CLK 32 O RGMII RECEIVE CLOCK: Provides the recovered receive clocks for different modes of operation:
2.5MHz in 10Mbps mode.
25MHz in 100Mbps mode.
125MHz in 1000Mbps mode.
SGMII_COP 33 S, O Differential SGMII Clock Output: This signal is a continuous 625MHz clock signal driven by the PHY in SGMII mode.
This pin can be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
RX_D0 33 S, O, PD RECEIVE DATA Bit 0: This signal carries data from the PHY to the MAC in RGMII mode. This pin is synchronous to the receive clock RX_CLK.
SGMII_CON 34 S, O, PD Differential SGMII Clock Output: This signal is a continuous 625MHz clock signal driven by the PHY in SGMII mode.
This pin can be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
RX_D1 34 O, PD RECEIVE DATA Bit 1: This signal carries data from the PHY to the MAC in RGMII mode. This pin is synchronous to the receive clock RX_CLK.
SGMII_SOP 35 S, O, PD Differential SGMII Data Output: This signal carries data from the PHY to the MAC in SGMII mode. This pin is synchronous to the differential SGMII clock output.
This pin can be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
RX_D2 35 S, O, PD RECEIVE DATA Bit 2: This signal carries data from the PHY to the MAC in RGMII mode. This pin is synchronous to the receive clock RX_CLK.
SGMII_SON 36 S, O, PD Differential SGMII Data Output: This signal carries data from the PHY to the MAC in SGMII mode. This pin is synchronous to the differential SGMII clock output.
This pin can be AC-coupled to the MAC through a 0.1µF capacitor when operating in SGMII mode.
RX_D3 36 O, PD RECEIVE DATA Bit 3: This signal carries data from the PHY to the MAC in RGMII mode. This pin is synchronous to the receive clock RX_CLK.
TX_CTRL 37 I, PD TRANSMIT CONTROL: In RGMII mode, This pin combines the transmit enable and the transmit error signals of GMII mode using both clock edges.
RX_CTRL 38 S, O, PD RECEIVE CONTROL: In RGMII mode, the receive data available and receive error are combined (RXDV_ER) using both rising and falling edges of the receive clock (RX_CLK).
GENERAL-PURPOSE I/O
GPIO_0 39 S, O, PD General-Purpose I/O: This signal provides a multi-function configurable I/O. Refer to the GPIO_MUX_CTRL register for details.
GPIO_1 40 S, O, PD General-Purpose I/O: This signal provides a multi-function configurable I/O. Refer to the GPIO_MUX_CTRL register for details.
MANAGEMENT INTERFACE
MDC 16 I, PD MANAGEMENT DATA CLOCK: Synchronous clock to the MDIO serial management input and output data. This clock can be asynchronous to the MAC transmit and receive clocks. The maximum clock rate is 25MHz and no minimum.
MDIO 17 I/O MANAGEMENT DATA I/O: Bidirectional management instruction and data signal that can be sourced by the management station or the PHY. This pin requires pullup resistor. The IEEE specified resistor value is 1.5kΩ, but a 2.2kΩ is acceptable.
INT / PWDN 44 I/O, PU INTERRUPT / POWER DOWN:
The default function of this pin is POWER DOWN.
POWER DOWN: This is an Active Low Input. Asserting this signal low enables the power-down mode of operation. In this mode, the device powers down and consume minimum power. Register access is available through the Management Interface to configure and power up the device.
INTERRUPT: When operating the pin as an interrupt, this pin uses an open-drain architecture. TI recommends using an external 2.2kΩ resistor connected to the VDDIO supply.
RESET
RESET_N 43 I, PU RESET: The active low RESET initializes or reinitializes the DP83867. All internal registers re-initialize to default state upon assertion of RESET. The RESET input must be held low for a minimum of 1µs.
CLOCK INTERFACE
XI 15 I CRYSTAL/OSCILLATOR INPUT: 25MHz oscillator or crystal input (50ppm)
XO 14 O CRYSTAL OUTPUT: Second terminal for 25MHz crystal. Must be left floating if a clock oscillator is used.
CLK_OUT 18 O CLOCK OUTPUT: Output clock
JTAG INTERFACE
JTAG_CLK 20 I, PU JTAG TEST CLOCK: IEEE 1149.1 Test Clock input, primary clock source for all test logic input and output controlled by the testing entity. Supports a maximum clock frequency of 2.5MHz.
JTAG_TDO 21 O JTAG TEST DATA OUTPUT: IEEE 1149.1 Test Data Output pin, the most recent test results are scanned out of the device through TDO.
JTAG_TMS 22 I, PU JTAG TEST MODE SELECT: IEEE 1149.1 Test Mode Select pin, the TMS pin sequences the Tap Controller (16-state FSM) to select the desired test instruction. TI recommends applying 3 clock cycles with JTAG_TMS high to reset the JTAG.
JTAG_TDI 23 I, PU JTAG TEST DATA INPUT: IEEE 1149.1 Test Data Input pin, test data is scanned into the device through TDI.
LED INTERFACE
LED_2 45 S, I/O, PD LED_2: By default, this pin indicates receive or transmit activity. Additional functionality is configurable through LEDCR1[11:8] register bits.
LED_1 46 S, I/O, PD LED_1: By default, this pin indicates that 1000BASE-T link is established. Additional functionality is configurable through LEDCR1[7:4] register bits.
LED_0 47 S, I/O, PD LED_0: By default, this pin indicates that link is established. Additional functionality is configurable through LEDCR1[3:0] register bits.
MEDIA DEPENDENT INTERFACE
TD_P_A 1 A Differential Transmit and Receive Signals
TD_M_A 2 A Differential Transmit and Receive Signals
TD_P_B 4 A Differential Transmit and Receive Signals
TD_M_B 5 A Differential Transmit and Receive Signals
TD_P_C 7 A Differential Transmit and Receive Signals
TD_M_C 8 A Differential Transmit and Receive Signals
TD_P_D 10 A Differential Transmit and Receive Signals
TD_M_D 11 A Differential Transmit and Receive Signals
OTHER PINS
RBIAS 12 A Bias Resistor Connection. A 11kΩ ±1% resistor can be connected from RBIAS to GND.
POWER AND GROUND PINS
VDDA2P5 3, 9 P 2.5V Analog Supply (±5%). Each pin requires a 1µF and 0.1µF capacitor to GND.
VDD1P0 6, 24, 31, 42 P 1V Analog Supply (+15.5%, –5%). Each pin requires a 1µF and 0.1µF capacitor to GND.
VDDA1P8 13, 48 P 1.8V Analog Supply (±5%).
No external supply is required for this pin. When unused, no connections can be made to this pin.
For additional power savings, an external 1.8V supply can be connected to these pins. When using an external supply, each pin requires a 1µF and 0.1µF capacitor to GND.
VDDIO 19, 30, 41 P I/O Power: 1.8V (±5%), 2.5V (±5%) or 3.3V (±5%). Each pin requires a 1µF and 0.1µF capacitor to GND
GND Die Attach Pad P Ground
The following list defines the functionality of each pin.
  • Type: I Input
  • Type: O Output
  • Type: I/O Input/Output
  • Type: PD, PU Internal Pulldown/Pullup
  • Type: S Configuration Pin
  • Type: P Power or GND
  • Type: A Analog pins