SNOS631E November   1994  – March 2025 LMC6061 , LMC6062 , LMC6062-MIL , LMC6064

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: LMC6061
    5. 5.5 Thermal Information: LMC6062
    6. 5.6 Thermal Information: LMC6064
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Applications Information
      1. 6.1.1 Amplifier Topology
      2. 6.1.2 Compensating For Input Capacitance
      3. 6.1.3 Capacitive Load Tolerance
      4. 6.1.4 Latchup
    2. 6.2 Typical Applications
      1. 6.2.1 Instrumentation Amplifier
      2. 6.2.2 Low-Leakage Sample-and-Hold
      3. 6.2.3 1Hz Square-Wave Oscillator
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
        1. 6.3.1.1 Printed Circuit Board Layout For High Impedance Work
      2. 6.3.2 Layout Example
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

7.4 Electrostatic Discharge Caution

LMC6061 LMC6062 LMC6064 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.