SNOSDI8B May   2024  – February 2026 LMG2650

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 GaN Power FET Switching Parameters
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  GaN Power FET Switching Capability
      2. 7.3.2  Turn-On Slew-Rate Control
      3. 7.3.3  Current-Sense Emulation
      4. 7.3.4  Bootstrap Diode Function
      5. 7.3.5  Input Control Pins (EN, INL, INH, GDH)
      6. 7.3.6  INL - INH Interlock
      7. 7.3.7  AUX Supply Pin
        1. 7.3.7.1 AUX Power-On Reset
        2. 7.3.7.2 AUX Under-Voltage Lockout (UVLO)
      8. 7.3.8  BST Supply Pin
        1. 7.3.8.1 BST Power-On Reset
        2. 7.3.8.2 BST Under-Voltage Lockout (UVLO)
      9. 7.3.9  Overcurrent Protection
      10. 7.3.10 Overtemperature Protection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 LLC Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 AHB Application
      3. 8.2.3 Motor Drives Application
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Solder-Joint Stress Relief
        2. 8.4.1.2 Signal-Ground Connection
        3. 8.4.1.3 CS Pin Signal
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.5 Electrical Characteristics

1) Symbol definitions: VDS(ls) = SW to SL voltage; IDS(ls) = SW to SL current; VDS(hs) = DH to SW voltage; ID(hs) = DH to SW current; ISW = SW point current into device; 2) Unless otherwise noted: voltage, resistance, and capacitance are respect to AGND; –40°C ≤ TJ ≤ 125°C; VDS(ls) = 520V; VDS(hs) = 520V; 10V ≤ VAUX ≤ 26V; 7.5V ≤ VBST_SW ≤ 26V; VEN = 5V; VINL = 0V; VINH = 0V; VGDH_SW = 0V; RCS = 100Ω
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
GAN POWER FETS
RDS(on) Drain-source (DH to SW) or (SW to SL) on resistance VINL or VINH = 5V, ID = 5.25A, TJ = 25°C 95 mΩ
VINL or VINH = 5V, ID = 5.25A, TJ = 125°C 171
VSD Source-drain (SW to DH) or (SL to SW) third-quadrant voltage SW to DH or SL to SW current = 0.525A 1.9 V
SW to DH or SL to SW current = 5.25A 2.6
IDSS Drain (DH to SW) or (SW to SL) leakage current (VDS(ls) = 0V, VDS(hs) = 650V) or (VDS(hs) = 0V, VDS(ls) = 650V), TJ = 25°C 3.6 µA
(VDS(ls) = 0V, VDS(hs) = 650V) or (VDS(hs) = 0V, VDS(ls) = 650V), TJ = 125°C 18.2
QOSS Output charge (VDS(ls) = 0V, VDS(hs) = 400V) or (VDS(hs) = 0V, VDS(ls) = 400V) 34.7 nC
COSS Output capacitance 54.2 pF
EOSS Output capacitance stored energy 4.69 µJ
COSS,er Energy related effective output capacitance 58.1 pF
COSS,tr Time related effective output capacitance (VDS(ls) = 0V, VDS(hs) = 0V to 400V) or (VDS(hs) = 0V, VDS(ls) = 0V to 400V) 86.3 pF
QRR Reverse recovery charge 0 nC
OVERCURRENT PROTECTION
IT(OC) Overcurrent fault – threshold current 9 10.5 12.1 A
BOOTSTRAP RECTIFIER
RDS(on) AUX to BST on resistance VINL = 5V, VAUX_BST = 1V, TJ = 25°C 8 Ω
VINL = 5V, VAUX_BST = 1V, TJ = 125°C 14
AUX to BST current limit VINL = 5V, VAUX_BST = 7V 210 240 270 mA
BST to AUX reverse current blocking threshold VINL = 5V 3 10 20 mA
CS
Current sense gain (ICS(src) / ID(LS)) VINL = 5V, 0V ≤ VCS ≤ 2V, 0A ≤ ID(ls)< IT(OC)(ls) 0.554 mA/A
Current sense input offset current VINL = 5V, 0V ≤ VCS ≤ 2V, 0A ≤ ID(ls)< IT(OC)(ls) –91 91 mA
Initial held output after overcurrent fault occurs while INL remains high VINL = 5V, 0V ≤ VCS ≤ 2V 7 mA
Final held output after overcurrent fault occurs while INL remains high VINL = 5V, 0V ≤ VCS ≤ 2V 8.5 12 15.5 mA
Output clamp voltage VINL = 5V, ID(ls) = 9.0A, CS sinking 5mA from external source 2.6 V
EN, INL, INH to AGND; GDH to SW
VIT+ Positive-going input threshold voltage 1.7 2.45 V
VIT– Negative-going input threshold voltage  0.7 1.3 V
Input threshold voltage hysteresis 1 V
Pull-down input resistance 0V ≤ VPIN ≤ 3V 200 400 600 kΩ
Pull-down input current 10V ≤ VPIN ≤ 26V; VAUX = 26V 10 µA
OVERTEMPERATURE PROTECTION
Temperature fault – postive-going threshold temperature 150 165 °C
Temperature fault – negative-going threshold temperature 150 °C
Temperature fault – threshold temperature hysteresis 15 °C
AUX
VAUX,T+(UVLO) UVLO – positive-going threshold voltage 8.9 9.3 9.75 V
UVLO – negative-going threshold voltage 8.6 9.0 9.5 V
UVLO – threshold voltage hysteresis 250 mV
Standby quiescent current VEN = 0V 50 110 µA
Quiescent current 250 400 µA
VINL = 5V, ID(ls) = 0A 1550
Operating current VINL = 0V or 5V, VDS(ls) = 0V, ID(ls) = 0A, fINL = 500kHz 4.5 mA
BST
VBST_SW,T+(UVLO) VBST_SW UVLO for FET to turn on – positive-going threshold voltage 6.8 7 7.4 V
VBST_SW UVLO for FET to stay on– negative-going threshold voltage 4.8 5.1 5.4 V
Quiescent current 70 120 µA
VINH = 5V, ID(hs) = 0A 900
VGDH_SW = 5V, ID(hs) = 0A 900
Operating current VINH = 0V or 5V, VDS(hs) = 0V, IDS(hs) = 0A; fINH = 500kHz 2.3 mA
VINH = 0V or 5V, VDS(hs) = 400V or 0V, ISW = 1A; fINH = 500kHz 3