SNOU212 December   2024 LMG3650R025

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
  7. 2Hardware
    1. 2.1 LMG3650EVM-113 Daughter Card Variants
    2. 2.2 LMG3650EVM-113 Daughter Card Pin Description
    3. 2.3 LMG3650EVM-113 Daughter Card Block Diagram
    4. 2.4 LMG3650EVM-113 Fault
    5. 2.5 LMG3650EVM-113 Bootstrap Mode
    6. 2.6 LMG3650EVM-113 Heat Sink
  8. 3Implementation Results
    1. 3.1 Test Equipment
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  10. 5Additional Information
    1. 5.1 Trademarks

2.6 LMG3650EVM-113 Heat Sink

The LMG3650EVM-113 comes with a heatsink installed for heat dissipation. The LMG3650R025 is cooled through the bottom side cooling pad of the device. The heat is transferred through vias in the PCB to exposed copper on the back side of the PCB. These vias are filled and capped (IPC-4761 Type-7) so the solder doesn’t fill into them creating solder voids underneath the LMG3650R025. There is a electrically isolating thermal interface material to thermally connect the heatsink to the PCB.

The heatsink has a fan attached for better thermal dissipation. The LMG342X-BB-EVM can power the fan by plugging it into header J15. For other motherboards the fan can be plugged into an eternal supply. The fan is power through 12V power supply (red – 12V, black – Ground, yellow – no connect).