SNVAAB2 November   2025

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2System Description
  6. 3Classification
  7. 4EMI and EMC General Overview
    1. 4.1 EMI
    2. 4.2 EMC
    3. 4.3 EMI and EMC Testing
  8. 5Test Description
  9. 6Test Details and Results
    1. 6.1 Burst: IEC 61000-4-4
    2. 6.2 ESD: IEC 61000-4-2
    3. 6.3 Surge: IEC 61000-4-5
    4. 6.4 Cond-EMS: IEC 61000-4-6
    5. 6.5 Rad-EMS: IEC 61000-4-3
    6. 6.6 Cond-EMS EN 61000-6-3 EMCL DC (LISN)
    7. 6.7 CISPR 32
    8. 6.8 Cond-EMS CISPR 32 Signal
    9. 6.9 Rad EMS CISPR 32 FAR
  10. 7Summary
  11. 8References

Abstract

The document describes a series of Electromagnetic Interference (EMI)/Electromagnetic Compatibility (EMC) measurements performed on the TIDA-010261 board, a Sitara-based microcontroller development platform for the DP83TD510E Single Pair Ethernet PHY. The goal was to identify sources of EMI and EMC issues. The tests revealed excessive emissions in the frequency range of 100MHz to 300MHz, likely caused by power supply noise, SD-card clocking, and internal charger-pump noise generated by diodes. To mitigate this issue, adjustments were made to the PCB design, including shielding, trace length matching, and using an inner EMMC. The final results showed significantly reduced emissions, meeting CISPR 32 standards.