SNVAAB2 November   2025

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2System Description
  6. 3Classification
  7. 4EMI and EMC General Overview
    1. 4.1 EMI
    2. 4.2 EMC
    3. 4.3 EMI and EMC Testing
  8. 5Test Description
  9. 6Test Details and Results
    1. 6.1 Burst: IEC 61000-4-4
    2. 6.2 ESD: IEC 61000-4-2
    3. 6.3 Surge: IEC 61000-4-5
    4. 6.4 Cond-EMS: IEC 61000-4-6
    5. 6.5 Rad-EMS: IEC 61000-4-3
    6. 6.6 Cond-EMS EN 61000-6-3 EMCL DC (LISN)
    7. 6.7 CISPR 32
    8. 6.8 Cond-EMS CISPR 32 Signal
    9. 6.9 Rad EMS CISPR 32 FAR
  10. 7Summary
  11. 8References

1 Introduction

This document is a detailed technical report on the Electromagnetic Interference (EMI) and Electromagnetic Compatibility (EMC) testing results for a 10 BASE-T1L Ethernet reference design, TIDA-010261. The report covers various aspects of EMI/EMC testing, including:

  1. Introduction: Overview of EMI/EMC testing concepts and their importance in product development.
  2. Test Setup: Description of the test setup for radiated emissions (RE), conductive emissions (CE), and electromagnetic susceptibility (EMS) tests, in accordance with CISPR 32 and IEC standards.
  3. Radiated Emissions Test Results:
    • Figures 6-15 to 6-25 display plots of radiated emission results for Class A and Class B devices at various distances from the antenna.
    • Table 6-6 lists CISPR 32 FAR test result data for shielded SPE cable and unshielded twisted pair frequencies, including minimum and maximum measured values.
  4. Conducted Emissions Test Results: Figures 6-16 to 6-18 depict conducted emission results at 50kHz and 30MHz frequency ranges for Class A and Class B devices using CISPR 32 measurement standards.
  5. Electromagnetic Susceptibility (EMPS) Test:
    • Figures 9-36 illustrate the setup for radiated immunity tests to investigate susceptibility of TIDA-010261 to electromagnetic sources.
  6. Results Analysis: Discussion on EMI/EMC test data, indicating successful passes in all conducted and radiated emission tests but potential opportunities for improvement (for example., using internal SD Cards or matching circuit traces).
  7. Summary: Recap of the EMI/EMC testing results, highlighting achievements and avenues for process enhancement.

Some takeaways from this document are:

  • The 10 BASE-T1L Ethernet reference design demonstrated good success in passing most EMI/EMC tests.
  • There is an opportunity to reduce noise radiation caused by internal high-speed components such as SD Cards.
  • Optimizing the trace length and impedance in electronic circuit design can help mitigate EMI behavior.

This technical report is useful for engineers working on product development in a range of industries, particularly those dealing with complex electronics and needing guidance on applying electromagnetic susceptibility testing to the systems.