SNVSC52A December   2021  – October 2026 LP5864

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7.     14
    8. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Time-Multiplexing Matrix
      2. 7.3.2 Analog Dimming (Current Gain Control)
      3. 7.3.3 PWM Dimming
      4. 7.3.4 ON and OFF Control
      5. 7.3.5 Data Refresh Mode
      6. 7.3.6 Full Addressable SRAM
      7. 7.3.7 Protections and Diagnostics
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Interface Selection
      2. 7.5.2 I2C Interface
        1. 7.5.2.1 I2C Data Transactions
        2. 7.5.2.2 I2C Data Format
        3. 7.5.2.3 Multiple Devices Connection
      3. 7.5.3 SPI
        1. 7.5.3.1 SPI Data Transactions
        2. 7.5.3.2 SPI Data Format
        3. 7.5.3.3 Multiple Devices Connection
  9. 8 Register Maps
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Program Procedure
      5. 9.2.5 Application Performance Plots
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Description

Electronic devices are becoming smarter, requiring to use larger quantity of LEDs for animation and indication purposes and high performance LED matrix driver is required to improve user experience with small device size.

The LP586x devices are a family of high performance LED matrix drivers. The device integrates 18 constant current sinks with N (N = 1/2/4/6/8/11) switching MOSFETs to support N × 18 LED dots or N × 6 RGB LEDs. The LP5864 integrates 4 MOSFETs for up to 72 LED dots or 24 RGB LEDs.

The LP5864 supports both analog dimming and PWM dimming methods. For analog dimming, each LED dot can be adjusted with 256 steps. For PWM dimming, the integrated 8-bit or 16-bit configurable PWM generators enable smooth and audible-noise-free dimming control. Each LED dot can also be arbitrarily mapped into 8-bit Group PWM to achieve dimming control together.

The LP5864 device implements full addressable SRAM to minimize the data traffic. The ghost-cancellation circuitry is integrated to eliminate both upside and downside ghosting. The LP5864 also supports LED open and short detection functions. Both 1MHz (maximum) I2C and 12MHz (maximum) SPI are available in LP5864.

Package Information
PART NUMBERPACKAGE(1)PACKAGE SIZE(2)
LP5864RSM (VQFN, 32)4mm × 4mm
For more information, see Section 12.
The package size (length × width) is a nominal value and includes pins, where applicable
LP5864 Simplified Schematic Simplified Schematic