SNVSCQ2B March   2025  – September 2026 LP5817

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Dimming
      2. 7.3.2 PWM Dimming
      3. 7.3.3 Sloper
      4. 7.3.4 Protections
        1. 7.3.4.1 UVLO
        2. 7.3.4.2 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Initialization Mode
      2. 7.4.2 Standby and Normal Mode
      3. 7.4.3 Shutdown Mode
      4. 7.4.4 Thermal Shutdown Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Data Tansactions
      2. 7.5.2 I2C Data Format
      3. 7.5.3 Command Description
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Parameters
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Program Procedure
        2. 8.2.3.2 Programming Example
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.4.1 Layout Guidelines

The input capacitor needs not only to be close to the VCC pin, but also to the GND pin to reduce input supply ripple. For OUTx (x = 0, 1, 2), low inductive and resistive path of switch load loop can help to provide a high slew rate. Therefore, path of adjacent outputs must be short and wide and avoid parallel wiring and narrow trace. For better thermal performance, TI suggest to make copper polygon connected with each pin bigger.