SNVSCS6 March   2026 TPS7H1301-SP

ADVMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options Table
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Quality Conformance Inspection
    7. 7.7 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Enable
      2. 9.3.2  Charge Pump
        1. 9.3.2.1 Charge Pump Operation
        2. 9.3.2.2 Foldback Switching
      3. 9.3.3  Startup
      4. 9.3.4  Power Good
      5. 9.3.5  Output Voltage
      6. 9.3.6  Dropout
      7. 9.3.7  Output Voltage Accuracy
      8. 9.3.8  Output Noise
      9. 9.3.9  Power Supply Rejection Ratio
      10. 9.3.10 Stability
        1. 9.3.10.1 Stability of the TPS7H1301
        2. 9.3.10.2 Stability of the TPS7H1302
      11. 9.3.11 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Enable Disable
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Capacitor Selection
          1. 10.2.2.1.1 Input Capacitor (CIN) Selection
          2. 10.2.2.1.2 CFLY
          3. 10.2.2.1.3 CPOUT Capacitor
          4. 10.2.2.1.4 Bypass Capacitors
          5. 10.2.2.1.5 Output Capacitor
        2. 10.2.2.2 Charge Pump Output Resistance
        3. 10.2.2.3 Output Noise
        4. 10.2.2.4 PSRR Design Implications
        5. 10.2.2.5 Stability Design Considerations
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information
    1.     69

4 Device Options Table

Generic Part Number Radiation Rating(1) Grade Package Orderable Part Number
TPS7H1301SP TID characterization up to 100 krad(Si) and DSEE free up to LET = 75 MeV⋅cm2 /mg QMLV-RHA 14-pin ceramic flat pack (CFP) HBL 5962R2421501VXC(4)
QMLP-RHA 28-pin plastic HTSSOP (PWP) 5962R2421501PYE(3)
None Engineering Sample(2) 14-pin ceramic flat pack (CFP) HBL TPS7H1301HBL/EM(4)
TPS7H1302SP TID characterization up to 100 krad(Si) and DSEE free up to LET = 75 MeV⋅cm2 /mg QMLV-RHA 14-pin ceramic flat pack (CFP) HBL 5962R2421502VXC(3)
QMLP-RHA 28-pin plastic HTSSOP (PWP) 5962R2421502PYE(3)
None Engineering Sample(2) 14-pin ceramic flat pack (CFP) HBL TPS7H1302HBL/EM(3)
TPS7H1301-SEP TID of 50krad(Si) RLAT, DSEE free to 43MeV⋅cm2 /mg Space Enhanced Plastic 28-pin plastic HTSSOP (PWP) TPS7H1301PWPTSEP(3)
TPS7H1302-SEP TID of 50krad(Si) RLAT, DSEE free to 43MeV⋅cm2 /mg Space Enhanced Plastic 28-pin plastic HTSSOP (PWP) TPS7H1302PWPTSEP(3)
(1) TID is total ionizing dose and DSEE is destructive single event effects. Additional information is available in the associated TID reports and SEE reports for each product.
(2) These units are intended for engineering evaluation only. The units are processed to a non-compliant flow (such as no burn-in and only 25°C testing). These units are not designed for qualification, production, radiation testing, or flight use. Parts are not warranted as to performance over temperature or operating life.
(3) Product preview
(4) Advanced information