SNVU893 March   2025

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 Additional Images
    2. 2.2 Power Requirements
    3. 2.3 Setup and Operation
  7. 3Implementation Results
    1. 3.1 Evaluation Setup
    2. 3.2 Performance Data and Results
  8. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  9. 5Additional Information
    1. 5.1 Trademarks

PCB Layouts

LM65635EVM PCB Top Layer Figure 4-2 PCB Top Layer
LM65635EVM PCB Ground Layer (Directly Below Top
          Layer) Figure 4-3 PCB Ground Layer (Directly Below Top Layer)
LM65635EVM PCB Signal Layer Figure 4-4 PCB Signal Layer
LM65635EVM PCB Bottom Layer Figure 4-5 PCB Bottom Layer