SNVU898A
May 2024 – October 2024
1
Description
Features
Applications
5
1
Evaluation Module Overview
1.1
Introduction
1.2
Kit Contents
1.3
Specification
1.3.1
Application Circuit Diagram
1.4
Device Information
2
Hardware
2.1
Test Setup and Procedure
2.1.1
EVM Connections
2.1.2
Test Equipment
2.1.3
Recommended Test Setup
2.1.3.1
Input Connections
2.1.3.2
Output Connections
2.1.4
Test Procedure
2.1.4.1
Line and Load Regulation, Efficiency
3
Implementation Results
3.1
Test Data and Performance Curves
3.1.1
Conversion Efficiency
3.1.2
Operating Waveforms
3.1.2.1
Load Transient Response
3.1.2.2
Line Transient Response
3.1.2.3
Start-Up and Shutdown With VIN
3.1.3
CISPR 25 EMI Performance
4
Hardware Design Files
4.1
Schematic
4.2
PCB Layout
4.2.1
Component Drawings
4.3
Bill of Materials
5
Device and Documentation Support
5.1
Device Support
5.1.1
Development Support
5.2
Documentation Support
5.2.1
Related Documentation
5.2.1.1
PCB Layout Resources
5.2.1.2
Thermal Design Resources
6
Additional Information
6.1
Trademarks
7
Revision History
5.2.1.2
Thermal Design Resources
AN-2020 Thermal Design by Insight, Not Hindsight
application report
AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Pad Packages
application report
Semiconductor and IC Package Thermal Metrics
application report
Thermal Design Made Simple with LM43603 and LM43602
application report
PowerPAD Thermally Enhanced Package
application report
PowerPAD Made Easy
application brief
Using New Thermal Metrics
application report