SPRAD85D December   2024  – October 2025 AM62A1-Q1 , AM62A3 , AM62A3-Q1 , AM62A7 , AM62A7-Q1 , AM62D-Q1

 

  1.   1
  2.   Abstract
  3. 1 Introduction
    1. 1.1 Before Getting Started With the Custom Board Design
    2. 1.2 Processor-Specific SDK
    3. 1.3 Peripheral Circuit Implementation - Compatibility Between Processor Families
    4. 1.4 Selection of Required Processor OPN (Orderable Part Number)
      1. 1.4.1 Processor Support for Secure Boot and Functional Safety
    5. 1.5 Technical Documentation
      1. 1.5.1 Updated SK or EVM Schematic With Design, Review and Cad Notes Added
        1. 1.5.1.1 AM62A7, AM62A7-Q1, AM62A3, AM62A3-Q1, AM62A1-Q1
        2. 1.5.1.2 AM62D-Q1
      2. 1.5.2 Collaterals on TI.com, Processor Product Page
      3. 1.5.3 Schematic Design Guidelines and Schematic Review Checklist - Processor Family Specific User's Guide
      4. 1.5.4 Updates to Hardware Design Considerations User's Guide
      5. 1.5.5 Processor and Peripherals Related FAQs to Support Custom Board Designs
    6. 1.6 Custom Board Design Documentation
    7. 1.7 Processor and Processor Peripherals Design Related Queries During Custom Board Design
  4. 2 Custom Board Design Block Diagram
    1. 2.1 Developing the Custom Board Design Block Diagram
    2. 2.2 Configuring the Boot Mode
    3. 2.3 Configuring the Processor Pins Functionality (PinMux Configuration)
  5. 3 Power Supply
    1. 3.1 Power Supply Architecture
      1. 3.1.1 Integrated Power Architecture
      2. 3.1.2 Discrete Power Architecture
    2. 3.2 Processor Supply (Power) Rails (Operating Voltage)
      1. 3.2.1 Supported Low-Power Modes
        1. 3.2.1.1 Partial IO Support for CAN/GPIO/UART Wakeup
      2. 3.2.2 Core Power Supply
      3. 3.2.3 Peripherals Power Supply
      4. 3.2.4 Dual-Voltage IO Supply for IO Group (Processor) Power Supply
      5. 3.2.5 Dynamic Voltage Switching Dual-Voltage Power Supply
      6. 3.2.6 VPP (eFuse ROM Programming) Power Supply
      7. 3.2.7 Internal LDOs for IO Supply for IO Groups (Processor)
    3. 3.3 Power Supply Filtering
    4. 3.4 Power Supply Decoupling and Bulk Capacitors
      1. 3.4.1 Note on PDN Target Impedance
    5. 3.5 Power Supply Sequencing
    6. 3.6 Power Supply Diagnostics (Using Processor Supported External Input Voltage Monitors)
    7. 3.7 Power Supply Diagnostics (Monitoring Using External Monitoring Circuit (Devices))
    8. 3.8 Custom Board Current Requirements Estimation and Supply Sizing
  6. 4 Processor Clock (Input and Output)
    1. 4.1 Processor Clocking (External Crystal or External Oscillator)
      1. 4.1.1 WKUP_LFOSC0 Connection When Unused
      2. 4.1.2 MCU_OSC0 and WKUP_LFOSC0, Crystal Selection
      3. 4.1.3 LVCMOS Compatible Digital Clock Input Source
    2. 4.2 Processor Clock Outputs
      1. 4.2.1 Observation Clock Outputs
    3. 4.3 Clock Tree Tool
  7. 5 JTAG (Joint Test Action Group)
    1. 5.1 JTAG / Emulation
      1. 5.1.1 Configuration of JTAG / Emulation
        1. 5.1.1.1 BSDL File
      2. 5.1.2 Implementation of JTAG / Emulation
      3. 5.1.3 Connection Recommendations for JTAG Interface Signals
      4. 5.1.4 Debug Boot Modes and Boundary Scan Compliance
  8. 6 Configuration (Processor) and Initialization (Processor and Device)
    1. 6.1 Processor Reset
    2. 6.2 Latching of Processor Boot Mode Configuration Inputs
    3. 6.3 Resetting of the Attached Device
    4. 6.4 Watchdog Timer
  9. 7 Processor - Peripherals Connection
    1. 7.1  Supported Processor Cores and MCU Cores
    2. 7.2  Selecting Peripherals Across Domains
    3. 7.3  Memory Controller (DDRSS)
      1. 7.3.1 Processor DDR Subsystem and Device Register Configuration
      2. 7.3.2 Calibration Resistor Connection for DDRSS
      3. 7.3.3 Attached Memory Device ZQ and Reset_N (Memory Device Reset) Connection
    4. 7.4  Media and Data Storage Interfaces (MMC0, MMC1, MMC2, OSPI0/QSPI0 and GPMC0)
    5. 7.5  Ethernet Interface
      1. 7.5.1 Common Platform Ethernet Switch 3-port Gigabit (CPSW3G0)
    6. 7.6  Programmable Real-Time Unit Subsystem (PRUSS)
    7. 7.7  Universal Serial Bus (USB) Subsystem
    8. 7.8  General Connectivity Peripherals
      1. 7.8.1 Inter-Integrated Circuit (I2C) Interface
    9. 7.9  Display Subsystem (DSS)
    10. 7.10 CSI-Rx (Camera Serial interface)
      1. 7.10.1 AM62Ax
      2. 7.10.2 AM62D-Q1
    11. 7.11 Real-Time Clock (RTC) Module
    12. 7.12 Connection of Processor Power Supply Pins, IOs and Peripherals When not Used
      1. 7.12.1 External Interrupt (EXTINTn)
      2. 7.12.2 RSVD Reserved Pins (Signals)
    13. 7.13 SK or EVM Specific Circuit Implementation (Reuse)
  10. 8 Interfacing of Processor IOs (LVCMOS or SDIO or Open-Drain, Fail-Safe Type IO Buffers) and Performing Simulations
    1. 8.1 IBIS Model
    2. 8.2 IBIS-AMI Model
  11. 9 Processor Current Draw and Thermal Analysis
    1. 9.1 Power Estimation
    2. 9.2 Maximum Current Rating for Different Supply Rails
    3. 9.3 Supported Power Modes
    4. 9.4 Thermal Design Guidelines
      1. 9.4.1 Thermal Model
      2. 9.4.2 VTM (Voltage Thermal Management Module)
  12. 10Schematic:- Capture, Entry and Review
    1. 10.1 Custom Board Design Passive Components and Values Selection
    2. 10.2 Custom Board Design Electronic Computer Aided Design (ECAD) Tools Considerations
    3. 10.3 Custom Board Design Schematic Capture
    4. 10.4 Custom Board Design Schematic Review
  13. 11Floor Planning, Layout, Routing Guidelines, Board Layers and Simulation
    1. 11.1 Escape Routing for PCB Design
    2. 11.2 LPDDR4 Design and Layout Guidelines
    3. 11.3 High-Speed Differential Signals Routing Guidelines
    4. 11.4 Processor-Specific SK or EVM Board Layout
    5. 11.5 Custom Board Layer Count and Layer Stack-up
      1. 11.5.1 Simulation Recommendations
    6. 11.6 DDR-MARGIN-FW
    7. 11.7 Reference for Steps to be Followed for Running Board Simulation
    8. 11.8 Software Development Training (Academy) for Processors
  14. 12Custom Board Assembly and Testing
    1. 12.1 Custom Board Bring-Up Tips and Debug Guidelines
  15.   Trademarks
  16. 13Processor (Device) Handling and Assembly
    1. 13.1 Processor (Device) Soldering Recommendations
      1. 13.1.1 Additional References
  17. 14Terminology
  18. 15References
    1. 15.1 AM62A7, AM62A7-Q1, AM62A3, AM62A3-Q1, AM62A1-Q1
    2. 15.2 AM62D-Q1
    3. 15.3 Common
  19. 16Revision History

13 Processor (Device) Handling and Assembly

Moisture Sensitivity Level (MSL) rating/Peak reflow rating depends on the package dimensions (thickness and volume).

Recommended reviewing the device thickness information, ball pitch, Lead finish/Ball material and the recommended MSL rating/Peak reflow to be followed.

For more information, see the following links:

AM62A7 Ordering & quality

AM62A7-Q1 Ordering & quality

AM62A3 Ordering & quality

AM62A3-Q1 Ordering & quality

AM62A1-Q1 Ordering & quality

AM62D-Q1 Ordering & quality