SPRADK5 June   2025 TDA4VM

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Physical Boot Mode DIP Switch Configuration
    1. 2.1 eMMC Boot Mode Switch for Primary Boot Mode
    2. 2.2 MMC/SD Boot Mode Switch for Backup Boot Mode
  6. 3Experiment
    1. 3.1 Prepare eMMC Boot Images for Primary Boot Mode
    2. 3.2 Prepare MMC/SD Boot Images for Backup Boot Mode
    3. 3.3 eMMC Memory Layout
    4. 3.4 Verify Redundant Boot
  7. 4Summary
  8. 5References

3.1 Prepare eMMC Boot Images for Primary Boot Mode

The following build commands can be used to generate boot images for eMMC boot, which serves as the primary boot mode:

cd ${PDK_PATH}/packages/ti/build
make -sj6 sbl_emmc_boot0_img BOARD=j721e_evm CORE=mcu1_0
make -sj6 boot_app_mmcsd_qnx HLOSBOOT=qnx BOARD=j721e_evm CORE=mcu1_0

Once the build process is complete, the following binaries are generated:

  • tiboot3.bin (SBL)
  • app (bootapp)

After building the binaries, flash them to the eMMC boot1 partition at the predefined offsets.

mmc dev 0 1
mmc partconf 0 1 1 1
mmc bootbus 0 2 0 0
fatload mmc 1 ${loadaddr} tiboot3.bin
mmc write ${loadaddr} 0x0 0x400
fatload mmc 1 ${loadaddr} tifs.bin
mmc write ${loadaddr} 0x400 0x1000
fatload mmc 1 ${loadaddr} app
mmc write ${loadaddr} 0x1400 0x2000

tiboot3.bin is flashed at 0x0, tifs.bin is flashed at 0x400, and app is flashed at 0x1400.