SPRADS5 December   2025 AM625 , AM62A7 , AM62D-Q1 , AM62P , AM6442

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Terminology
  6. 3Understanding Boot Mode and Flash Compatibility
  7. 4Flash Integration and SysConfig Setup
    1. 4.1 FLASH Parameters
      1. 4.1.1 Recommended Approach
    2. 4.2 OSPI Parameters
  8. 5Common Bring-up Issues and Debugging
    1. 5.1 Boot Failure
    2. 5.2 Known Errata
    3. 5.3 Flash Initialization Failure
      1. 5.3.1 FLASH and OSPI SysConfig Values
      2. 5.3.2 Flash Device and Manufacture ID Read Failure
      3. 5.3.3 PHY Failure
    4. 5.4 Flash Read Failure
    5. 5.5 Flash Program Failure
  9. 6Checklist for Requesting OSPI and FLASH Support
  10. 7Summary
  11. 8References

Abstract

This application note provides guidance on bringing up a custom flash part on TI Sitara™ processors using MCU+SDK. The document addresses the challenges faced by developers working on custom boards that use flash part different from those available on TI evaluation modules (EVMs).

The document outlines the steps required to integrate, configure and validate a new flash part to verify reliable operation with the TI software ecosystem. The target audience includes engineers and developers who are designing custom hardware and need to enable flash communication through an SPI/QSPI/OSPI interface.

Following this application note helps reduce bring-up time and minimizes common integration issues, enabling faster development and debugging of custom flash configurations.