SPRUIT8D February   2020  – February 2021 AWR2243

 

  1.   Trademarks
  2. 1Getting Started
    1. 1.1 Introduction
    2. 1.2 Key Features
    3. 1.3 What is Included
      1. 1.3.1 Kit Contents
      2. 1.3.2 mmWave Proximity Demo
  3. 2Hardware
    1. 2.1 Block Diagram
    2. 2.2 Connecting BoosterPack™ to LaunchPad™ or MMWAVE-DEVPACK
    3. 2.3 Power Connections
    4. 2.4 Connectors
      1. 2.4.1 20-Pin BoosterPack™ Connectors
      2. 2.4.2 60-Pin High Density (HD) Connector
    5. 2.5 PC Connection
      1. 2.5.1 Erasing Onboard Serial Flash
      2. 2.5.2 Connection With MMWAVE-DEVPACK
      3. 2.5.3 Connecting the BoosterPack to the DCA1000
    6. 2.6 Antenna
    7. 2.7 Jumpers, Switches, and LEDs
      1. 2.7.1 Sense On Power Jumpers
      2. 2.7.2 Current Measurement
      3. 2.7.3 Push Buttons and LEDs
      4. 2.7.4 Selection Between SPI and CAN Interface
  4. 3Design Files and Software Tools
    1. 3.1 LDO Bypass Requirement
  5. 4Design Revision History
  6. 5Mechanical Mounting of PCB
  7. 6PCB Storage and Handling Recommendations
  8. 7Regulatory Information
  9. 8Revision History

Design Files and Software Tools

For Rev A boards:

Note:

Boards with a Rev 'B' sticker have had capacitor C56 (VBGAP decoupling capacitor) changed from 0.22 µF to 0.047 µF (part number CGA2B3X7R1H473K050BB). TI recommends that customers incorporate this change with an equivalent capacitor in their designs.