STDA022 January   2026 MSPM0L1305

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Background
  6. 3Procedure
  7. 4Assessment Methods and Results
    1. 4.1 Initial Data Collection
    2. 4.2 BLR With In Situ Monitoring
    3. 4.3 BLR Without In Situ Monitoring
  8. 5Summary of Results
  9. 6Conclusion
  10. 7Acknowledgements
  11. 8References

8 References

  1. IPC-A-610E-2010, Acceptability of Electronic Assemblies, April 2010.
  2. JESD22-A104D, Temperature Cycling, March 2009.
  3. IPC-9701A, Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments, February 2006.
  4. IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard, February 2005.