Units that were soldered on all four sides underwent temperature cycling and were monitored for event detection. In general, board-level reliability testing is an accelerated test, which can be used to correlate the actual field life of solder joints with test performance based on acceleration factors dependent on the device application. According to IPC-9701A (which provides guidance on temperature cycle testing), the requirement is that a minimum of 1000 cycles must pass without electrical failure for acceptance [3]. The units in this study showed no failure even after 6870 cycles for both the 100μm and 200μm overhang, suggesting good board-level reliability.