STDA022 January   2026 MSPM0L1305

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Background
  6. 3Procedure
  7. 4Assessment Methods and Results
    1. 4.1 Initial Data Collection
    2. 4.2 BLR With In Situ Monitoring
    3. 4.3 BLR Without In Situ Monitoring
  8. 5Summary of Results
  9. 6Conclusion
  10. 7Acknowledgements
  11. 8References

7 Acknowledgements

The author wishes to recognize the following individuals for providing assistance:

  • Bailey Cordell, Rey Javier, Steve Kummerl, and Frank Mortan of Texas Instruments' Packaging Technology Solutions, Dallas, for technical inputs and analysis of results.
  • Andy Zhang, William Gifford, and Paul Hull of Texas Instruments' Dallas Reliability Test Lab, Dallas, for PCB design and board-level reliability test execution.
  • Robert Milotta, Alison Stutzmann, and Paul Talbot of Texas Instruments' Dallas Design Analysis Operation, Dallas, for package imaging and solder joint measurements.
  • Peter Nguyen of Chip Targets Inc, Dallas, for package imaging and solder joint measurements.