The TI TDA4VH-Q1 is packaged in a compact 31mm × 31mm flip chip ball grid array (FCBGA) package that enables IPC class 3 PCB routing. The operating junction temperature range of –40℃ to 125℃ enables designers to deploy the device in designs with passive cooling designs. The total power consumption of the TDA4VH-Q1 is use-case dependent and varies with the features enabled by the application software design. However, TI provides an easy-to-use power estimation tool [4] that designers can use to quickly assess power consumption across different use cases before designing the actual system hardware. In the worst-case with all compute cores and interfaces fully utilized, the TDA4VH-Q1 consumes under 35W at 105℃ junction temperature.

For the class of drone platforms most relevant to TDAx deployment - multi-rotor systems in the 3kg to 25 kg takeoff weight range used for industrial inspection, survey, logistics, and defense applications - a 10W to 20W companion computer power budget is typical. TI's power estimation tool enables designers to model realistic workloads rather than worst-case scenarios. For example, a representative configuration running two concurrent object detection models on the C7 NPU cluster, stereo depth processing on the DMPAC, and Linux application management on the Cortex-A72 cluster operates well within the 10W to 15W range, leaving thermal and power headroom for additional workloads or more aggressive duty cycling. Smaller platforms with tighter power budgets can use lower-tier members of the TDAx family to right-size compute and power consumption for the application.