SWRA714B July   2021  – June 2025 CC1312PSIP , CC1312R , CC1312R7 , CC1314R10 , CC1352P , CC1352P7 , CC1352R

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Acronyms
  5. 2 Overview
  6. 3 Reference Examples
  7. 4 RF Protocols – Wi-SUN® PHYs
  8. 5 Software Block Diagram
  9. 6 Network Topology and Features
  10. 7 Security
    1. 7.1 Certificate Management
    2. 7.2 Key Exchange Process
  11. 8 Performance and Test Data
    1. 8.1 Latency Test
    2. 8.2 Join-time Test
    3. 8.3 OAD Test
  12. 9 Out-of-box Experience
  13. 10Training
  14. 11Tools
    1. 11.1 Code Composer Studio IDE
    2. 11.2 SysConfig
    3. 11.3 Packet Sniffer
    4. 11.4 TI Wi-SUN FAN Spinel
    5. 11.5 TI wfantund – User-Space Network Interface Driver
  15. 12Known Limitations

3 Reference Examples

The SimpleLink™ SDK incorporates a number of examples for the different roles in a Wi-SUN® FAN. Not every role and example is available for every device. This is due to the memory requirements of some roles. Lower memory devices are therefore not be able to be used as a border router role. A list of examples with the corresponding capable devices is listed in Table 3 and Table 4.

Table 3 Code Examples Included in the SDK
Application Usage

ti-wisunfan-pyspinel

 Python interface module to control a NWP from a Linux or Microsoft® Windows® 10 PC. Public on TI GitHub

ti-wisunfantund

Linux network interface to control a NWP from Linux as a network interface. Public on TI GitHub
ns_br

ns_br_src*

 Border router in NWP configuration controlled over UART with TI-defined API (based on SPINEL interface layer).
ns_node

ns_node_src*

 Router node in NWP configuration controlled over UART with TI defined API (based on SPINEL interface layer).
ns_coap_node

ns_coap_node_src*

 Embedded router node example with CoAP server.

ns_coap_oad_offchip

ns_coap_oad_offchip_src*

 Embedded router node example with off-chip Over-the-Air-Download capability and CoAP server.

ns_coap_oad_onchip

ns_coap_oad_onchip_src*

 Embedded router node example with on-chip Over-the-Air-Download capability and CoAP server.
*the src examples include the nanostack source code
Table 4 Memory Usage With Reference Examples Running on Select TI Devices
SDK

examples

Occupied FLASH [kB]

 Occupied RAM[kB]

Supported Devices
ns_br

367

122

CC1312R7, CC1352P7, CC1352R7, CC1354P10, CC1354R10

ns_node

310

64

CC1312R, CC1312PSIP, CC1352R, CC1352P, CC1352P7, CC1352R7, CC1354P10, CC1354R10
ns_coap_node, ns_coap_oad_offchip

310

60

 CC1312R7, CC1352P7, CC1352R7, CC1354P10, CC1354R10

ns_coap_oad_onchip

310

61

CC1354P10, CC1354R10

For on-chip OAD the FLASH is split into 2 application slots each of 344kB.

The memory footprint is based on using the TIRTOS7 and TICLANG compiler. It is possible that the footprint varies when using FreeRTOS or another compiler. See summary of memory sizes of each device in the wireless MCU overview on TI.com