SimpleLink™ Arm Cortex-M4F multiprotocol Sub-1 GHz & 2.4 GHz wireless MCU integrated power amplifier
Product details
Parameters
Package | Pins | Size
Features
- Microcontroller
- Powerful 48-MHz Arm Cortex-M4F processor
- EEMBC CoreMark score: 148
- 352KB of in-system programmable flash
- 256KB of ROM for protocols and library functions
- 8KB of cache SRAM (alternatively available as general-purpose RAM)
- 80KB of ultra-low leakage SRAM. The SRAM is protected by parity to ensure high reliability of operation.
- 2-pin cJTAG and JTAG debugging
- Supports over-the-air (OTA) update
- Ultra-low power sensor controller with 4KB of SRAM
- Sample, store, and process sensor data
- Operation independent from system CPU
- Fast wake-up for low-power operation
- TI-RTOS, drivers, bootloader, Bluetooth 5.2 low energy controller, and IEEE 802.15.4 MAC in ROM for optimized application size
- RoHS-compliant package
- 7-mm × 7-mm RGZ VQFN48 (26 GPIOs)
- Peripherals
- Digital peripherals can be routed to any GPIO
- 4× 32-bit or 8× 16-bit general-purpose timers
- 12-bit ADC, 200 kSamples/s, 8 channels
- 2× comparators with internal reference DAC (1× continuous time, 1× ultra-low power)
- Programmable current source
- 2× UART
- 2× SSI (SPI, MICROWIRE, TI)
- I2C and I2S
- Real-time clock (RTC)
- AES 128- and 256-bit cryptographic accelerator
- ECC and RSA public key hardware accelerator
- SHA2 accelerator (full suite up to SHA-512)
- True random number generator (TRNG)
- Capacitive sensing, up to 8 channels
- Integrated temperature and battery monitor
- External system
- On-chip buck DC/DC converter
- TCXO support
- Low power
- Wide supply voltage range: 1.8 V to 3.8 V
- Active mode RX: 5.8 mA (3.6 V, 868 MHz), 6.9 mA (3.0 V, 2.4 GHz)
- Active mode TX at +20 dBm: 63 mA (3.3 V, 915 MHz), 85 mA (3.0 V, 2.4 GHz)
- Active mode TX at +10 dBm: 22 mA (2.4 GHz)
- Active mode MCU 48 MHz (CoreMark): 2.9 mA (60 µA/MHz)
- Sensor controller, low power-mode, 2 MHz, running infinite loop: 30.1 µA
- Sensor controller, active mode, 24 MHz, running infinite loop: 808 µA
- Standby: 0.85 µA (RTC on, 80KB RAM and CPU retention)
- Shutdown: 150 nA (wakeup on external events)
- Radio section
- Multi-band sub-1 GHz and 2.4 GHz RF transceiver compatible with Bluetooth 5.2 Low Energy and earlier LE specifications, and IEEE 802.15.4 PHY and MAC
- 3-wire, 2-wire, 1-wire PTA coexistence mechanisms
- Excellent receiver sensitivity: -121 dBm for SimpleLink long-range mode -110 dBm at 50 kbps, -105 dBm for Bluetooth 125-kbps (LE Coded PHY)
- Output power up to +20 dBm with temperature compensation
- Suitable for systems targeting compliance with worldwide radio frequency regulations
- ETSI EN 300 220 Receiver Category 1.5 and 2, EN 300 328, EN 303 131, EN 303 204 (Europe)
- EN 300 440 Category 2
- FCC CFR47 Part 15
- ARIB STD-T108 and STD-T66
- Wide standard support
- Wireless protocols
- Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY, Wireless M-Bus, Wi-SUN, KNX RF, Amazon Sidewalk, proprietary systems, SimpleLink™ TI 15.4-Stack (Sub-1 GHz), and dynamic multiprotocol manager (DMM) driver.
- Development Tools and Software
- LAUNCHXL-CC1352P1 and LAUNCHXL-CC1352P-2 Development Kits
- SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK)
- SmartRF™ Studio for simple radio configuration
- Sensor Controller Studio for building low-power sensing applications
All trademarks are the property of their respective owners.
Description
The SimpleLink™CC1352P device is a multiprotocol and multi-band Sub-1 GHz and 2.4-GHz wireless microcontroller (MCU) supporting Thread, Zigbee , Bluetooth 5.2 Low Energy, IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY, Wi-SUN, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz and 2.4 GHz), and concurrent multiprotocol through a Dynamic Multiprotocol Manager (DMM) driver. The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:
- Multi-band device supporting concurrent multiprotocol for both Sub-1 GHz and 2.4 GHz through a DMM driver.
- Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK).
- Enablement of long-range and low-power applications using the integrated +20 dBm high-power amplifier with best-in-class transmit current consumption at 63 mA for Sub-1 GHz and 85 mA for 2.4 GHz operation.
- Optimized for coin-cell operation at +10 dBm with 22 mA current consumption.
- Longer battery life wireless applications with low standby current of 0.85 µA and full RAM retention.
- Industrial temperature ready with lowest standby current of 5 µA at 85°C.
- Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.
- Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.
- Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.
- Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.
The CC1352P device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The BOOSTXL-AOA demonstration board is a BoosterPack intended to be used with the CC26X2R LaunchPad, to evaluate Angle-of-Arrival (AoA) applications. The BOOSTXL-AOA is setup with multiple dipole antennas that are utilized to extract information about the source of a signal using a combination of (...)
Features
- 40-pin BoosterPack standard leveraging the LaunchPad ecosystem
- JSC connector to extend RF path from a Launchpad
- 6 integrated PCB-based dipole antennas
- 3 antenna switches
- 2 LEDs (Green/Red)
Description
To get started visit dev.ti.com/BOOSTXL-ULPSENSE
The ULP Sense BoosterPack is a kit designed to make it easy to demonstrate the ultra-low power features of the sensor controller included in the CC13x2/CC26x2 RF SoCs.
Examples of applications that will greatly benefit from this are measurement on (...)
Features
- 40-pin BoosterPack standard leveraging the LaunchPad ecosystem
- Inductive flow meter measurements - LC circuits and logical gates
- Ultra-Low Power accelerometer
- Two Cap touch buttons
- Analog Light Sensor
- Reed Switch
- Potentiometer (0 to 200 kOhm range)
Description
The TI LaunchPad™ SensorTag kit offers integrated environmental and motion sensors, multi band wireless connectivity and easy-to-use software for prototyping connected applications. With one kit, developers can easily create connected applications featuring Bluetooth® Low Energy, Bluetooth (...)
Features
- Offers FCC, CE, and IC certified radio for multi band operation at 2.4GHz and Sub-1 GHz empowering the developer with simultaneous operation across multiple wireless stacks (Bluetooth® Low Energy, Bluetooth mesh, Sub-1 GHz, Thread, Zigbee®, and 802.15.4)
- Supports IEEE 802.15.4g, IPv6-enabled smart (...)
Description
The Texas Instruments XDS110 EnergyTrace™ High Dynamic Range (ETHDR) is an accessory to the XDS110 Debug Probe (emulator) that increases the Dynamic Range of the Energy Trace feature. This allows performing very accurate power consumption measurements on all Simplelink Wireless MCUs while (...)
Features
The Texas Instruments XDS110 EnergyTrace™ High Dynamic Range (ETHDR) is the first accessory to the XDS110 Debug Probe (emulator). Designed to be a complete plug-in solution that brings EnergyTrace to the higher power wireless connectivity systems, it features an improved range, resolution and (...)
Description
The Texas Instruments XDS110 is a new class of debug probe (emulator) for TI embedded processors. The XDS110 replaces the XDS100 family while supporting a wider variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a single pod. Also, all XDS debug probes support Core and System Trace in all ARM and (...)
Features
The XDS110 is the latest entry level debug probe (emulators) for TI embedded processors. Designed to be a complete solution that delivers JTAG and SWD connectivity at a low cost, the XDS110 is the debug probe of choice for entry-level debugging of TI microcontrollers, processors and SimpleLink (...)
Description
The Spectrum Digital XDS200 is the first model of the XDS200 family of debug probes (emulators) for TI processors. The XDS200 family features a balance of low cost with good performance between the super low cost XDS110 and the high performance XDS560v2, while supporting a wide variety of standards (...)
Features
The XDS200 is the mid-range family of JTAG debug probes (emulators) for TI processors. Designed to deliver good performance and the most common features that place it between the low cost XDS110 and the high performance XDS560v2, the XDS200 is the balanced solution to debug TI microcontrollers (...)
Description
This LaunchPad speeds development on devices with integrated power amplifier and multi-band radio support for concurrent Sub-1Ghz and 2.4-GHz operation. Protocols supported include Bluetooth® Low Energy, Sub-1 GHz, Thread, Zigbee®, 802.15.4, and proprietary RF with the compatible (...)
Features
- Broad band antenna support for Sub-1 GHz (868 MHz / 915 MHz / 433 MHz) and 2.4 GHz frequency bands
- On-board emulator gets you started with instant code development
- All IOs accessible on pin headers compatible with the LaunchPad/BoosterPack eco system
Description
Amazon Sidewalk is a shared network that helps products like Amazon Echo devices, Ring security, outdoor lights and motion sensors work better at home and beyond the front door. When enabled, Sidewalk can unlock unique benefits for your end-product, support other Sidewalk devices in the community (...)
Features
- Broad band antenna support for Sub-1 GHz (868 MHz / 915 MHz / 433 MHz) and 2.4 GHz frequency bands
- On-board emulator gets you started with instant code development
- All IOs accessible on pin headers compatible with the LaunchPad/BoosterPack ecosystem
TI and Sidewalk benefits
- Network benefits:
- Lower cost (...)
Software development
Features
- TI 15.4-Stack, an IEEE 802.15.4-based star topology networking solution for the Sub-1 GHz band (learn more at www.ti.com/LongRange)
- Supports development of proprietary Sub-1 GHz and 2.4 GHz applications using the RF driver and the EasyLink Abstraction Layer (learn more at www.ti.com/LongRange)
- TI (...)
Features
- TI Arm® Clang Compiler Tools release 1.2.1.STS:
- Improved compiler-generated code size vs. legacy TI compiler
- GCC-compatible compiler command-line interface
- Source-Based Code Coverage, including Branch Coverage
- With tiarmprofdata and tiarmcov utilities to help with visualization
- Support for Arm C Language (...)
Features
- Includes ready to use examples for several common use-cases
- Full toolchain with built-in compiler and assembler for programming in a C-like programming language
- Provides rapid development by using the integrated sensor controller task testing and debugging functionality including visualization of (...)
Features
The SimpleLink SDK plug-in for HomeKit applications provides a consistent API, across both Wi-Fi (IP) and Bluetooth™ Low Energy protocols, that supports these services:
- HomeKit Accessory Protocol (HAP)
- Security services: cipher, signing, key management
- Software or Hardware MFi Authentication
- (...)
SmartRF Flash Programmer can be used to program the flash memory in Texas Instruments 8051-based low-power RF wireless MCUs and for (...)
Features
- Programming of SW images on low-power RF wireless MCUs
- Programming/updating firmware and bootloader on the Evaluation Boards' USB MCU
- Append software image to existing software on device
- Read out software image from device into binary, hex or ELF files (elf and bin for ARM-devices only)
- Verify software (...)
Features
- Link tests. Send and Receive packets between nodes.
- Antenna and radiation tests. Set the radio in continuous wave TX and RX states.
- A set of recommended/typical register settings for all devices.
- Read and write individual RF registers.
- Execute individual commands to control the radio.
- Detailed (...)
CCS Uniflash is a standalone tool used to (...)
Design tools & simulation
Features
- Power calculator for TI devices using the SimpleLink 15.4 stack
Features
- Modules listed are based on TI wireless technology supporting Wi-Fi®, Bluetooth®, Zigbee®, Sub-1 GHz, Sigfox, 2.4 GHz, multi-band connectivity and more
- Modules integrate clocks, SPI flash and passive components
- Listings included for hardware customization, software integration and cloud services
- Listings (...)
Features
- Battery life estimator
- Use-case profile configurability
Features
- Packet sniffer for IEEE 802.15.4, ZigBee and Thread networks
- Packet sniffer for IEEE 802.15.4ge (TI 15.4 Stack) networks
- Packet sniffer for TI EasyLink protocol
- Packet sniffer for Bluetooth® Low Energy
Features
- Range estimate spreadsheet for Sub-1 GHz and 2.4 GHz devices
- Range debug checklist
Features
- Power calculator for CC13X2 and CC26X2 products using the Z-Stack software from the SimpleLink CC13X2 and CC26X2 software development kit (SDK)
- Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC1xxx product page links below).
- Step 2 (...)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| VQFN (RGZ) | 48 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.