SWRS255A March   2022  – April 2025 CC1311P3

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Power Supply and Modules
    5. 7.5  Power Consumption - Power Modes
    6. 7.6  Power Consumption - Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 861MHz to 1054MHz—Receive (RX)
    11. 7.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 7.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 7.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 7.14 359MHz to 527MHz—Receive (RX)
    15. 7.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 7.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 7.17 Timing and Switching Characteristics
      1. 7.17.1 Reset Timing
      2. 7.17.2 Wakeup Timing
      3. 7.17.3 Clock Specifications
        1. 7.17.3.1 48 MHz Crystal Oscillator (XOSC_HF)
        2. 7.17.3.2 48 MHz RC Oscillator (RCOSC_HF)
        3. 7.17.3.3 32.768 kHz Crystal Oscillator (XOSC_LF)
        4. 7.17.3.4 32 kHz RC Oscillator (RCOSC_LF)
      4. 7.17.4 Synchronous Serial Interface (SSI) Characteristics
        1. 7.17.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       38
      5. 7.17.5 UART
        1. 7.17.5.1 UART Characteristics
    18. 7.18 Peripheral Characteristics
      1. 7.18.1 ADC
        1. 7.18.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.18.2 DAC
        1. 7.18.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.18.3 Temperature and Battery Monitor
        1. 7.18.3.1 Temperature Sensor
        2. 7.18.3.2 Battery Monitor
      4. 7.18.4 Comparator
        1. 7.18.4.1 Continuous Time Comparator
      5. 7.18.5 GPIO
        1. 7.18.5.1 GPIO DC Characteristics
    19. 7.19 Typical Characteristics
      1. 7.19.1 MCU Current
      2. 7.19.2 RX Current
      3. 7.19.3 TX Current
      4. 7.19.4 RX Performance
      5. 7.19.5 TX Performance
      6. 7.19.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Proprietary Radio Formats
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  Voltage Supply Domains
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

10.1 Device Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to all part numbers and/or date-code. Each device has one of three prefixes/identifications: X, P, or null (no prefix) (for example, XCC1311P3 is in preview; therefore, an X prefix/identification is assigned).

Device development evolutionary flow:

    X Experimental device that is not necessarily representative of the final device's electrical specifications and may not use production assembly flow.
    P Prototype device that is not necessarily the final silicon die and may not necessarily meet final electrical specifications.
    null Production version of the silicon die that is fully qualified.

Support tool development evolutionary flow:

    TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
    TMDS Fully-qualified development-support product.

X and P devices and TMDX development-support tools are shipped against the following disclaimer:

"Developmental product is intended for internal evaluation purposes."

Production devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (X or P) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, RGZ).

For orderable part numbers of CC1311P3 devices in the RGZ (7mm x 7mm) package type, see the Package Option Addendum of this document, the Device Information in Section 3, the TI website (www.ti.com), or contact your TI sales representative.

CC1311P3 Device Nomenclature Figure 10-1 Device Nomenclature