SWRS269B June   2023  – February 2025 CC2674P10

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Functional Block Diagram
  6. Device Comparison
  7. Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules—RGZ Package
    4. 6.4 Pin Diagram—RSK Package (Top View)
    5. 6.5 Signal Descriptions—RSK Package
    6. 6.6 Connection of Unused Pins and Module—RSK Package
  8. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  3VModules
    5. 7.5  Power Consumption—Power Modes
    6. 7.6  Power Consumption—Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 Bluetooth Low Energy—Receive (RX)
    11. 7.11 Bluetooth Low Energy—Transmit (TX)
    12. 7.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps)—RX
    13. 7.13 Zigbee and Thread - IEEE 802.15.4–2006 2.4GHz (OQPSK DSSS1:8, 250kbps)—TX
    14. 7.14 Timing and Switching Characteristics
      1. 7.14.1 Reset Timing
      2. 7.14.2 Wakeup Timing
      3. 7.14.3 Clock Specifications
        1. 7.14.3.1 48MHz Clock Input (TCXO)
        2. 7.14.3.2 48MHz Crystal Oscillator (XOSC_HF)
        3. 7.14.3.3 48MHzRC Oscillator (RCOSC_HF)
        4. 7.14.3.4 2MHz RC Oscillator (RCOSC_MF)
        5. 7.14.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 7.14.3.6 32kHz RC Oscillator (RCOSC_LF)
      4. 7.14.4 Serial Peripheral Interface (SPI) Characteristics
        1. 7.14.4.1 SPI Characteristics
        2. 7.14.4.2 SPI Master Mode
        3. 7.14.4.3 SPI Master Mode Timing Diagrams
        4. 7.14.4.4 SPI Slave Mode
        5. 7.14.4.5 SPI Slave Mode Timing Diagrams
      5. 7.14.5 UART
        1. 7.14.5.1 UART Characteristics
    15. 7.15 Peripheral Characteristics
      1. 7.15.1 ADC
        1. 7.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.15.2 DAC
        1. 7.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.15.3 Temperature and Battery Monitor
        1. 7.15.3.1 Temperature Sensor
        2. 7.15.3.2 Battery Monitor
      4. 7.15.4 Comparators
        1. 7.15.4.1 Low-Power Clocked Comparator
        2. 7.15.4.2 Continuous Time Comparator
      5. 7.15.5 Current Source
        1. 7.15.5.1 Programmable Current Source
      6. 7.15.6 GPIO
        1. 7.15.6.1 GPIO DC Characteristics
    16. 7.16 Typical Characteristics
      1. 7.16.1 MCU Current
      2. 7.16.2 RX Current
      3. 7.16.3 TX Current
      4. 7.16.4 RX Performance
      5. 7.16.5 TX Performance
      6. 7.16.6 ADC Performance
  9. Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.3 Low Energy
      2. 8.3.2 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

TX Current

CC2674P10 TX Current vs. Temperature (BLE 1Mbps,
                                                  2.44GHz, 0dBm) Figure 7-8 TX Current vs.
Temperature (BLE 1Mbps, 2.44GHz, 0dBm)
CC2674P10 TX Current vs. Temperature (BLE 1Mbps,
                                                  2.44GHz, +10dBm PA, RSK package) Figure 7-9 TX Current vs.
Temperature (BLE 1Mbps, 2.44GHz, +10dBm PA, RSK package)
CC2674P10 TX Current vs. Temperature (BLE 1
                                                  Mbps, 2.44GHz, +20dBm PA, VDDS = 3.3V, RGZ
                                                  package) Figure 7-10 TX Current vs.
Temperature (BLE 1 Mbps, 2.44GHz, +20dBm PA, VDDS = 3.3V, RGZ package)
CC2674P10 TX
                                                  Current vs. Supply
                                                  Voltage (VDDS) (BLE 1 Mbps, 2.44GHz, 0dBm) Figure 7-11 TX Current vs.
Supply Voltage (VDDS) (BLE 1 Mbps, 2.44GHz, 0dBm)
CC2674P10 TX Current vs. Supply Voltage (VDDS)
                                                  (BLE 1Mbps, 2.44GHz, +10dBm PA, RSK
                                                  package) Figure 7-12 TX Current vs.
Supply Voltage (VDDS) (BLE 1Mbps, 2.44GHz, +10dBm PA, RSK package)
CC2674P10 TX Current vs. Supply Voltage (VDDS)
                                                  (BLE 1 Mbps, 2.44GHz, +20dBm PA, RGZ
                                                  package) Figure 7-13 TX Current vs.
Supply Voltage (VDDS) (BLE 1 Mbps, 2.44GHz, +20dBm PA, RGZ package)

Table 7-1 shows the typical TX current and output power for different output power settings for the RGZ (7mm × 7mm) package.

Table 7-1 Typical TX Current and Output Power (2.4GHz, VDDS = 3.0V, RGZ package)
CC2674P10 RGZ at 2.4GHz, VDDS = 3.0V (Measured on CC1354P10EM-XD7793-XD24-PA9093)
txPowerTX POWER SETTING (SmartRF Studio)TYPICAL OUTPUT POWER [dBm]TYPICAL CURRENT CONSUMPTION [mA]
0x003F55.09.8
0x8A2C44.39.2
0x731C33.18.4
0x601522.17.8
0x466110.77.3
0x385D0-0.17.0
0x2E55-3-2.56.2
0x2095-5-4.85.7
0x2093-6-5.85.5
0x188E–9-8.95.0
0x0ED3-10–9.75.0
0x0ED0-12-11.74.7
0x08CC-15-15.24.4
0x08C9-18-18.44.2
0x08C8-20-19.74.2
Table 7-2 Typical TX Current and Output Power (2.4GHz, VDDS = 3.3V, RGZ package, +20dBm PA)
CC2674P10 RGZ at 2.4GHz, VDDS = 3.3V (Measured on CC1352-7PEM-XD7793-XD24-PA24)
txPowerTX POWER SETTING (SmartRF Studio)TYPICAL OUTPUT POWER [dBm]TYPICAL CURRENT CONSUMPTION [mA]
0x3F75F52019.6102
0x3F61E21918.386
0x3047E01817.479
0x1B4FE51716.371
0x1B39DE1615.263
0x1B2FDA1514.358
0x1B27D61413.252
Table 7-3 Typical TX Current and Output Power (2.4GHz, VDDS = 3.0V, RSK package)
CC2674P10 RSK at 2.4GHz, VDDS = 3.0V (Measured on LP-EM-CC1354P10-1)
txPowerTX POWER SETTING (SmartRF Studio)TYPICAL OUTPUT POWER [dBm]TYPICAL CURRENT CONSUMPTION [mA]
0x003F54.79.4
0x802943.98.7
0x5C1D33.08.1
0x461622.17.6
0x326311.17.2
0x2A5E00.26.9
0x1CE6-3-2.86.1
0x1695-5-4.65.6
0x1693-6-5.65.4
0x0E8E–9-8.65.0
0x00D2-10–9.94.9
0x088A-12-12.04.6
0x08CC-15-14.64.4
0x00C9-18-17.64.3
0x00C7-20-20.24.1
Table 7-4 Typical TX Current and Output Power (2.4GHz, VDDS = 3.0V, RSK package, +10dBm PA)
CC2674P10 RSK at 2.4GHz, VDDS = 3.0V (Measured on LP-CC1354P-8x8-XD7793-XD24-PA24-10dBm)
txPowerTX POWER SETTING (SmartRF Studio)TYPICAL OUTPUT POWER [dBm]TYPICAL CURRENT CONSUMPTION [mA]
0x104F661010.225
0x103F5F99.223
0x10335A88.121
0x14285F77,120
0x144F2A66.318