SWRS269B June   2023  – February 2025 CC2674P10

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1. 6.1 Pin Diagram—RGZ Package (Top View)
    2. 6.2 Signal Descriptions—RGZ Package
    3. 6.3 Connections for Unused Pins and Modules—RGZ Package
    4. 6.4 Pin Diagram—RSK Package (Top View)
    5. 6.5 Signal Descriptions—RSK Package
    6. 6.6 Connection of Unused Pins and Module—RSK Package
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  3VModules
    5. 7.5  Power Consumption—Power Modes
    6. 7.6  Power Consumption—Radio Modes
    7. 7.7  Nonvolatile (Flash) Memory Characteristics
    8. 7.8  Thermal Resistance Characteristics
    9. 7.9  RF Frequency Bands
    10. 7.10 Bluetooth Low Energy—Receive (RX)
    11. 7.11 Bluetooth Low Energy—Transmit (TX)
    12. 7.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps)—RX
    13. 7.13 Zigbee and Thread - IEEE 802.15.4–2006 2.4GHz (OQPSK DSSS1:8, 250kbps)—TX
    14. 7.14 Timing and Switching Characteristics
      1. 7.14.1 Reset Timing
      2. 7.14.2 Wakeup Timing
      3. 7.14.3 Clock Specifications
        1. 7.14.3.1 48MHz Clock Input (TCXO)
        2. 7.14.3.2 48MHz Crystal Oscillator (XOSC_HF)
        3. 7.14.3.3 48MHzRC Oscillator (RCOSC_HF)
        4. 7.14.3.4 2MHz RC Oscillator (RCOSC_MF)
        5. 7.14.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 7.14.3.6 32kHz RC Oscillator (RCOSC_LF)
      4. 7.14.4 Serial Peripheral Interface (SPI) Characteristics
        1. 7.14.4.1 SPI Characteristics
        2. 7.14.4.2 SPI Master Mode
        3. 7.14.4.3 SPI Master Mode Timing Diagrams
        4. 7.14.4.4 SPI Slave Mode
        5. 7.14.4.5 SPI Slave Mode Timing Diagrams
      5. 7.14.5 UART
        1. 7.14.5.1 UART Characteristics
    15. 7.15 Peripheral Characteristics
      1. 7.15.1 ADC
        1. 7.15.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 7.15.2 DAC
        1. 7.15.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 7.15.3 Temperature and Battery Monitor
        1. 7.15.3.1 Temperature Sensor
        2. 7.15.3.2 Battery Monitor
      4. 7.15.4 Comparators
        1. 7.15.4.1 Low-Power Clocked Comparator
        2. 7.15.4.2 Continuous Time Comparator
      5. 7.15.5 Current Source
        1. 7.15.5.1 Programmable Current Source
      6. 7.15.6 GPIO
        1. 7.15.6.1 GPIO DC Characteristics
    16. 7.16 Typical Characteristics
      1. 7.16.1 MCU Current
      2. 7.16.2 RX Current
      3. 7.16.3 TX Current
      4. 7.16.4 RX Performance
      5. 7.16.5 TX Performance
      6. 7.16.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth 5.3 Low Energy
      2. 8.3.2 802.15.4 Thread, Zigbee, and 6LoWPAN
    4. 8.4  Memory
    5. 8.5  Sensor Controller
    6. 8.6  Cryptography
    7. 8.7  Timers
    8. 8.8  Serial Peripherals and I/O
    9. 8.9  Battery and Temperature Monitor
    10. 8.10 µDMA
    11. 8.11 Debug
    12. 8.12 Power Management
    13. 8.13 Clock Systems
    14. 8.14 Network Processor
  10. 9 Application, Implementation, and Layout
    1. 9.1 Reference Designs
    2. 9.2 Junction Temperature Calculation
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Tools and Software
      1. 10.2.1 SimpleLink™ Microcontroller Platform
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

7.12 Zigbee and Thread - IEEE 802.15.4-2006 2.4GHz (OQPSK DSSS1:8, 250kbps)—RX

Measured on the LP-EM-CC1354P10-1 reference design with Tc = 25°C, VDDS = 3.0V, fRF= 2440MHz with
DC/DC enabled and high power PA connected to VDDS unless otherwise noted.
All measurements are performed at the antenna input with a combined RX and TX path and through an RF switch as part of the reference design. All measurements are performed conducted.
 
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
General Parameters
Receiver sensitivityCoherent mode PER = 1%–105dBm
Receiver saturationPER = 1%> -10dBm
Adjacent channel rejectionWanted signal at –82dBm, modulated interferer at ±5MHz, PER = 1%36dB
Alternate channel rejectionWanted signal at –82dBm, modulated interferer at ±10MHz, PER = 1%55dB
Channel rejection, ±15MHz or moreWanted signal at –82dBm, undesired signal is IEEE 802.15.4 modulated channel, stepped through all channels 2405 to 2480MHz, PER = 1%
59dB
Blocking and desensitization,
5MHz from upper band edge		Wanted signal at 3dB above the sensitivity level, CW jammer, PER = 1%57dB
Blocking and desensitization,
10MHz from upper band edge		Wanted signal at 3dB above the sensitivity level, CW jammer, PER = 1%62dB
Blocking and desensitization,
20MHz from upper band edge		Wanted signal at 3dB above the sensitivity level, CW jammer, PER = 1%62dB
Blocking and desensitization,
50MHz from upper band edge		Wanted signal at 3dB above the sensitivity level, CW jammer, PER = 1%65dB
Blocking and desensitization,
–5MHzfrom lower band edge		Wanted signal at 3dB above the sensitivity level, CW jammer, PER = 1%60dB
Blocking and desensitization,
–10MHz from lower band edge		Wanted signal at 3dB above the sensitivity level, CW jammer, PER = 1%60dB
Blocking and desensitization,
–20MHz from lower band edge		Wanted signal at 3dB above the sensitivity level, CW jammer, PER = 1%60dB
Blocking and desensitization,
–50MHz from lower band edge		Wanted signal at 3dB above the sensitivity level, CW jammer, PER = 1%62dB
Spurious emissions, 30MHz to 1000MHzMeasurement in a 50Ω single-ended load–66dBm
Spurious emissions, 1GHz to 12.75GHzMeasurement in a 50Ω single-ended load–53dBm
Frequency error toleranceDifference between the incoming carrier frequency and the internally generated carrier frequency> 100ppm
Symbol rate error toleranceDifference between incoming symbol rate and the internally generated symbol rate> 800ppm
RSSI dynamic range95dB
RSSI accuracy±4dB