SWRS314C January   2024  – October 2026 AWR2544

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
    1. 3.1 Functional Block Diagram
  5. 4 Device Comparison
  6. 5 Related Products
  7. 6 Pin Configurations and Functions
    1. 6.1 Pin Diagram
    2. 6.2 Pin Attributes
    3. 6.3 Signal Descriptions - Digital
    4. 6.4 Signal Descriptions - Analog
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.5.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.5.2 Hardware Requirements
      3. 7.5.3 Impact to Your Hardware Warranty
    6. 7.6  Power Supply Specifications
    7. 7.7  Power Consumption Summary
    8. 7.8  RF Specifications
    9. 7.9  Thermal Resistance Characteristics
    10. 7.10 Power Supply Sequencing and Reset Timing
    11. 7.11 Input Clocks and Oscillators
      1. 7.11.1 Clock Specifications
    12. 7.12 Peripheral Information
      1. 7.12.1 QSPI Flash Memory Peripheral
        1. 7.12.1.1 QSPI Timing Conditions
        2. 7.12.1.2 QSPI Timing Requirements#GUID-C38B9713-DC57-4B3B-8AFF-A79AF70E5A5A/GUID-97D19708-D87E-443B-9ADF-1760CFEF6F4C#GUID-C38B9713-DC57-4B3B-8AFF-A79AF70E5A5A/GUID-0A61EEC9-2B95-4C27-B219-18D27C8F9430
        3. 7.12.1.3 QSPI Switching Characteristics#GUID-D1480E86-4079-4A44-A68A-26C2D9F4506B/T4362547-64#GUID-D1480E86-4079-4A44-A68A-26C2D9F4506B/T4362547-65
      2. 7.12.2 Multibuffered / Standard Serial Peripheral Interface (MibSPI)
        1. 7.12.2.1 MibSPI Peripheral Description
        2. 7.12.2.2 MibSPI Transmit and Receive RAM Organization
          1. 7.12.2.2.1 SPI Timing Conditions
          2. 7.12.2.2.2 SPI Controller Mode Switching Parameters (CLOCK PHASE = 0, SPICLK = output, SPISIMO = output, and SPISOMI = input)#GUID-3DD8619F-41DB-47CF-9AF7-5916CFF97E61/T4362547-236#GUID-3DD8619F-41DB-47CF-9AF7-5916CFF97E61/T4362547-237#GUID-3DD8619F-41DB-47CF-9AF7-5916CFF97E61/T4362547-238
          3. 7.12.2.2.3 SPI Controller Mode Switching Parameters (CLOCK PHASE = 1, SPICLK = output, SPISIMO = output, and SPISOMI = input)#GUID-220CE6B8-D17E-48AF-BF69-AAEC97D55C95/T4362547-244#GUID-220CE6B8-D17E-48AF-BF69-AAEC97D55C95/T4362547-245#GUID-220CE6B8-D17E-48AF-BF69-AAEC97D55C95/T4362547-246
        3. 7.12.2.3 SPI Peripheral Mode I/O Timings
          1. 7.12.2.3.1 SPI Peripheral Mode Switching Parameters (SPICLK = input, SPISIMO = input, and SPISOMI = output)#GUID-BF2B230C-8F03-4C6A-A240-6DFD0CEC87C8/T4362547-70#GUID-BF2B230C-8F03-4C6A-A240-6DFD0CEC87C8/T4362547-71#GUID-BF2B230C-8F03-4C6A-A240-6DFD0CEC87C8/T4362547-73
      3. 7.12.3 Ethernet Switch (RGMII/RMII/MII) Peripheral
        1. 7.12.3.1  RGMII/RMII/MII Timing Conditions
        2. 7.12.3.2  RGMII Transmit Clock Switching Characteristics
        3. 7.12.3.3  RGMII Transmit Data and Control Switching Characteristics
        4. 7.12.3.4  RGMII Receive Clock Timing Requirements
        5. 7.12.3.5  RGMII RX and TX Timing Diagrams
        6. 7.12.3.6  RGMII Receive Data and Control Timing Requirements
        7. 7.12.3.7  RMII Transmit Clock Switching Characteristics
        8. 7.12.3.8  RMII Transmit Data and Control Switching Characteristics
        9. 7.12.3.9  RMII Receive Clock Timing Requirements
        10. 7.12.3.10 RMII Receive Data and Control Timing Requirements
        11. 7.12.3.11 MII Transmit Switching Characteristics
        12. 7.12.3.12 MII Receive Clock Timing Requirements
        13. 7.12.3.13 MII Receive Timing Requirements
        14. 7.12.3.14 MII Transmit Clock Timing Requirements
        15. 7.12.3.15 MDIO Interface Timings
      4. 7.12.4 LVDS Instrumentation and Measurement Peripheral
        1. 7.12.4.1 LVDS Interface Configuration
        2. 7.12.4.2 LVDS Interface Timings
      5. 7.12.5 UART Peripheral
        1. 7.12.5.1 SCI Timing Requirements
      6. 7.12.6 Inter-Integrated Circuit Interface (I2C)
        1. 7.12.6.1 I2C Timing Requirements#GUID-5F6D5D17-1161-44B3-ABD1-283215937B93/T4362547-185
      7. 7.12.7 Enhanced Pulse-Width Modulator (ePWM)
      8. 7.12.8 General-Purpose Input/Output
        1. 7.12.8.1 Switching Characteristics for Output Timing versus Load Capacitance (CL)#GUID-918A19D2-41ED-481C-96AE-E1C69B8B3446/T4362547-45#GUID-918A19D2-41ED-481C-96AE-E1C69B8B3446/T4362547-50
    13. 7.13 Emulation and Debug
      1. 7.13.1 Emulation and Debug Description
      2. 7.13.2 JTAG Interface
        1. 7.13.2.1 Timing Requirements for IEEE 1149.1 JTAG
        2. 7.13.2.2 Switching Characteristics for IEEE 1149.1 JTAG
      3. 7.13.3 ETM Trace Interface
        1. 7.13.3.1 ETM TRACE Timing Requirements
        2. 7.13.3.2 ETM TRACE Switching Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Subsystems
      1. 8.3.1 RF and Analog Subsystem
        1. 8.3.1.1 RF Clock Subsystem
        2. 8.3.1.2 Transmit Subsystem
        3. 8.3.1.3 Receive Subsystem
      2. 8.3.2 Processor Subsystem
      3. 8.3.3 Automotive Interfaces
    4. 8.4 Other Subsystems
      1. 8.4.1 Hardware Accelerator Subsystem
      2. 8.4.2 Security – Hardware Security Module
      3. 8.4.3 ADC Channels (Service) for User Application
  10. 9 Monitoring and Diagnostics
    1. 9.1 Monitoring and Diagnostic Mechanisms
  11. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
    2. 10.2 Short and Medium Range Radar
    3. 10.3 Reference Schematic
  12. 11Device and Documentation Support
    1. 11.1 Device Support
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation support
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

12 Revision History

Changes from December 30, 2024 to October 2, 2026 (from Revision B (December 2024) to Revision C (October 2026))

  • (Description): Updated Design ConsiderationsGo

Changes from November 30, 2024 to December 30, 2024 (from Revision A (November 2024) to Revision B (December 2024))

  • (Description): Removed x-marked OPNs from the device description tableGo
  • (Signal Descriptions - Digital) : Add A7 and B11 to MSS_EPWMA_SYNCO table entryGo
  • (Recommended Operating Conditions for OTP eFuse Programming) : Updated with information on maximum duration of VPP supplyGo
  • (Power Consumption Summary_LOP) : Updated TBD valuesGo
  • (RF Specifications) : Updated Noise Figure, In-band P1dB vs Receiver GainGo
  • (RGMII RX and TX Timing Diagrams) : Added RGMII RX and TX Timing Diagrams SectionGo
  • (RGMII RX and TX Timing Diagrams) : Updated table with RX and TX delay informationGo
  • (RGMII Receive Data and Control Timing Requirements): Updated from 1ns to 1.25ns hold and setup time Go
  • (Device Nomenclature) : Updated Device NomenclatureGo

Changes from January 1, 2024 to November 30, 2024 (from Revision * (January 2024) to Revision A (November 2024))

  • (Features) : Added recommendations on power management solutionsGo
  • (Description): Updated ES2.0 silicon orderable part numbers (OPNs). Go
  • (Description): Removed x-marked OPNs from the device description tableGo
  • (Functional Block Diagram) : Updated the diagram to remove a footnote. Go
  • (Device Comparison) : Updated the table for AWR2243. Go
  • (Signal Descriptions - Digital) : Corrected descriptions for MSS_RGMII_RDx pinsGo
  • (Signal Descriptions - Digital) : Added a table-note for usage of MSS_MIBSPIB signalsGo
  • (Signal Descriptions - Digital) : Removed pins C20 and B20 from TRACE_CLK and TRACE_CTLGo
  • (Recommended Operating Conditions) : Updated MAX values for 1.2V digital and SRAM supply; and 1.8V supplyGo
  • (VPP Specifications) - Warranty Impact : Rephrased sectionGo
  • (Power Supply Specification) : Added Supply Ripple specsGo
  • (Power Supply Specification) : Added recommendations on power management solutionsGo
  • (Power Consumption Summary) : Updated the Max peak current numbers for 1.2V and 1.8V respectively from 2100mA and 600mA to 2000mA and 550mA in Table - Maximum Current Ratings at Power Terminals for ES2.0 siliconGo
  • (Power Consumption Summary) : Updated the Description conditions and power numbers in Table - Average Power Consumption at Power Terminals for ES2.0 siliconGo
  • (RF Specifications) : Improved Typical 1-dB compression point (Out Of Band) from -11dBm to -8dBm in ES2.0 siliconGo
  • (RF Specifications) : Updated table-notes for 1-dB compression point (Out Of Band) measurement technique and a new note added for VCO2 rangeGo
  • (RF Specifications) : Updated Noise Figure, In-band P1dB vs Receiver Gain figure in the sectionGo
  • (RF Specifications) :Corrected IF BW to 20MHzGo
  • (Clock Specifications): Updated/Changed "Crystal Electrical Characteristics (Oscillator Mode)" to reflect correct device operating temperature rangeGo
  • (QSPI Timing Conditions) : Updated the Output load capacitance from 2pF to 5pFGo
  • (QSPI Timing Requirements) : Updated the Setup time (Q12 and Q14) from 13.2ns to 5 nsGo
  • (QSPI Switching Characteristics): Updated/Changed Cycle time, sclk from 15ns to 12.5ns; Go
  • (QSPI Switching Characteristics): Updated/Changed Pulse duration, sclk i.e. [Q2, Q3] from 0.5*P – 1.5 to 0.5*P – 0.625 (Min). Go
  • (QSPI Switching Characteristics): Updated/Changed Delay time, sclk falling edge to d[0] transition i.e. [Q6, Q9] from 5.5ns to 2ns (Max) and -2.5ns to -4.5ns (Min). Go
  • (SPI Timing Conditions): Updated/Changed CLOAD, Output load capacitance from 15pF to 20pF (Max). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =0 ): Updated/Changed Cycle time, SPICLK from 40ns to 20ns; Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =0): Updated/Changed Pulse duration, SPICLK i.e. [Q2, Q3] from 0.5tc(SPC)M +- 4 to 0.5tc(SPC)M +- 2(Min/Max). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =0): Updated/Changed Delay time, SPISIMO valid before SPICLK low, i.e. [Q4] from 0.5tc(SPC)M – 14 to 0.5tc(SPC)M – 7 (Min). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =0): Updated/Changed Valid time, SPISIMO data valid after SPICLK low, i.e. [Q5] from 0.5tc(SPC)M – 18 to 0.5tc(SPC)M – 8 (Min). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =0): Updated/Changed Hold time, SPISOMI data valid after SPICLK i.e. [Q9] from 3ns to 2ns (Min). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =1 ): Updated/Changed Cycle time, SPICLK from 40ns to 20ns; Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =1): Updated/Changed Pulse duration, SPICLK i.e. [Q2, Q3] from 0.5tc(SPC)M +- 4 to 0.5tc(SPC)M +- 2(Min/Max). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =1): Updated/Changed Delay time, SPISIMO valid before SPICLK low, i.e. [Q4] from 0.5tc(SPC)M – 14 to 0.5tc(SPC)M – 7 (Min). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =1): Updated/Changed Valid time, SPISIMO data valid after SPICLK low, i.e. [Q5] from 0.5tc(SPC)M – 18 to 0.5tc(SPC)M – 8 (Min). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =1): Updated/Changed Hold time, SPISOMI data valid after SPICLK i.e. [Q9] from 3ns to 2ns (Min). Go
  • (SPI Peripheral Mode Switching Parameters ): Updated/Changed Cycle time, SPICLK from 50ns to 20ns; Go
  • (SPI Peripheral Mode Switching Parameters ): Updated/Changed Pulse duration, SPICLK i.e. [Q2, Q3] from 20ns to 8ns (Min). Go
  • (SPI Peripheral Mode Switching Parameters ): Updated/Changed Setup time, SPISIMO before SPICLK i.e. [Q6] from 6ns to 2.1ns (Min). Go
  • Updated RGMII/RMII/MII Timing ConditionsGo
  • (RGMII Receive Data and Control Timing Requirements): Updated/Changed Hold time, i.e. [No. 6] from 4.5ns to 1ns (Min). Go
  • (RMII Transmit Data and Control Switching Characteristics): Updated/Changed Delay time, REF_CLK high to selected transmit signals valid, i.e. [RMII 11] from 3ns to 2ns (Min). Go
  • (MII Transmit Switching Characteristics): Updated/Changed Delay time, miin_txclk to transmit selected signals valid, i.e. [No. 1] from 3ns to 0ns (Min). Go
  • (LVDS Interface Configuration) : Corrected a typo for the number of data lanes in LVDS from '4' to '2'Go
  • (Switching Characteristics for IEEE 1149.1 JTAG): Updated/Changed Delay time, TCK low to TDO valid, i.e. [No. 2] from 27.1ns to 21ns (Max). Go
  • Updated BW to 20MHzGo
  • (ADC Channels (Service) for User Application): Added a figure in the sectionGo
  • (Monitoring and Diagnostic Mechanisms): Updated the section and added a note for reference to safety related collateral. Go
  • (Monitoring and Diagnostic Mechanisms): Removed CRC-8 support since polynomials are not supported in the Design.Go
  • Added package to device nomenclatureGo
DATEREVISIONNOTES
January 2024*Initial Release

Changes from December 1, 2021 to March 14, 2023 (from Revision * (November 2021) to Revision A (March 2023))

  • (Features) : Added recommendations on power management solutionsGo
  • (Description): Updated ES2.0 silicon orderable part numbers (OPNs). Go
  • (Description): Removed x-marked OPNs from the device description tableGo
  • (Functional Block Diagram) : Updated the diagram to remove a footnote. Go
  • (Device Comparison) : Updated the table for AWR2243. Go
  • (Signal Descriptions - Digital) : Corrected descriptions for MSS_RGMII_RDx pinsGo
  • (Signal Descriptions - Digital) : Added a table-note for usage of MSS_MIBSPIB signalsGo
  • (Signal Descriptions - Digital) : Removed pins C20 and B20 from TRACE_CLK and TRACE_CTLGo
  • (Recommended Operating Conditions) : Updated MAX values for 1.2V digital and SRAM supply; and 1.8V supplyGo
  • (VPP Specifications) - Warranty Impact : Rephrased sectionGo
  • (Power Supply Specification) : Added Supply Ripple specsGo
  • (Power Supply Specification) : Added recommendations on power management solutionsGo
  • (Power Consumption Summary) : Updated the Max peak current numbers for 1.2V and 1.8V respectively from 2100mA and 600mA to 2000mA and 550mA in Table - Maximum Current Ratings at Power Terminals for ES2.0 siliconGo
  • (Power Consumption Summary) : Updated the Description conditions and power numbers in Table - Average Power Consumption at Power Terminals for ES2.0 siliconGo
  • (RF Specifications) : Improved Typical 1-dB compression point (Out Of Band) from -11dBm to -8dBm in ES2.0 siliconGo
  • (RF Specifications) : Updated table-notes for 1-dB compression point (Out Of Band) measurement technique and a new note added for VCO2 rangeGo
  • (RF Specifications) : Updated Noise Figure, In-band P1dB vs Receiver Gain figure in the sectionGo
  • (Clock Specifications): Updated/Changed "Crystal Electrical Characteristics (Oscillator Mode)" to reflect correct device operating temperature rangeGo
  • (QSPI Timing Conditions) : Updated the Output load capacitance from 2pF to 5pFGo
  • (QSPI Timing Requirements) : Updated the Setup time (Q12 and Q14) from 13.2ns to 5 nsGo
  • (QSPI Switching Characteristics): Updated/Changed Cycle time, sclk from 15ns to 12.5ns; Go
  • (QSPI Switching Characteristics): Updated/Changed Pulse duration, sclk i.e. [Q2, Q3] from 0.5*P – 1.5 to 0.5*P – 0.625 (Min). Go
  • (QSPI Switching Characteristics): Updated/Changed Delay time, sclk falling edge to d[0] transition i.e. [Q6, Q9] from 5.5ns to 2ns (Max) and -2.5ns to -4.5ns (Min). Go
  • (SPI Timing Conditions): Updated/Changed CLOAD, Output load capacitance from 15pF to 20pF (Max). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =0 ): Updated/Changed Cycle time, SPICLK from 40ns to 20ns; Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =0): Updated/Changed Pulse duration, SPICLK i.e. [Q2, Q3] from 0.5tc(SPC)M +- 4 to 0.5tc(SPC)M +- 2(Min/Max). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =0): Updated/Changed Delay time, SPISIMO valid before SPICLK low, i.e. [Q4] from 0.5tc(SPC)M – 14 to 0.5tc(SPC)M – 7 (Min). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =0): Updated/Changed Valid time, SPISIMO data valid after SPICLK low, i.e. [Q5] from 0.5tc(SPC)M – 18 to 0.5tc(SPC)M – 8 (Min). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =0): Updated/Changed Hold time, SPISOMI data valid after SPICLK i.e. [Q9] from 3ns to 2ns (Min). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =1 ): Updated/Changed Cycle time, SPICLK from 40ns to 20ns; Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =1): Updated/Changed Pulse duration, SPICLK i.e. [Q2, Q3] from 0.5tc(SPC)M +- 4 to 0.5tc(SPC)M +- 2(Min/Max). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =1): Updated/Changed Delay time, SPISIMO valid before SPICLK low, i.e. [Q4] from 0.5tc(SPC)M – 14 to 0.5tc(SPC)M – 7 (Min). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =1): Updated/Changed Valid time, SPISIMO data valid after SPICLK low, i.e. [Q5] from 0.5tc(SPC)M – 18 to 0.5tc(SPC)M – 8 (Min). Go
  • (SPI Controller Mode Switching Parameters, Clock Phase =1): Updated/Changed Hold time, SPISOMI data valid after SPICLK i.e. [Q9] from 3ns to 2ns (Min). Go
  • (SPI Peripheral Mode Switching Parameters ): Updated/Changed Cycle time, SPICLK from 50ns to 20ns; Go
  • (SPI Peripheral Mode Switching Parameters ): Updated/Changed Pulse duration, SPICLK i.e. [Q2, Q3] from 20ns to 8ns (Min). Go
  • (SPI Peripheral Mode Switching Parameters ): Updated/Changed Setup time, SPISIMO before SPICLK i.e. [Q6] from 6ns to 2.1ns (Min). Go
  • (RGMII Receive Data and Control Timing Requirements): Updated/Changed Hold time, i.e. [No. 6] from 4.5ns to 1ns (Min). Go
  • (RMII Transmit Data and Control Switching Characteristics): Updated/Changed Delay time, REF_CLK high to selected transmit signals valid, i.e. [RMII 11] from 3ns to 2ns (Min). Go
  • (MII Transmit Switching Characteristics): Updated/Changed Delay time, miin_txclk to transmit selected signals valid, i.e. [No. 1] from 3ns to 0ns (Min). Go
  • (LVDS Interface Configuration) : Corrected a typo for the number of data lanes in LVDS from '4' to '2'Go
  • (Switching Characteristics for IEEE 1149.1 JTAG): Updated/Changed Delay time, TCK low to TDO valid, i.e. [No. 2] from 27.1ns to 21ns (Max). Go
  • Updated BW to 20MHzGo
  • (ADC Channels (Service) for User Application): Added a figure in the sectionGo
  • (Monitoring and Diagnostic Mechanisms): Updated the section and added a note for reference to safety related collateral. Go
  • (Monitoring and Diagnostic Mechanisms): Removed CRC-8 support since polynomials are not supported in the Design.Go