SWRS349A June   2026  – July 2026 CC2340R5MODA

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configurations and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram - MHA Package (Top View)
    2.     10
    3. 6.2 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
      12.      23
      13.      24
      14.      25
      15.      26
      16.      27
    4. 6.3 Connections for Unused Pins and Modules
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DCDC
    5. 7.5  Global LDO (GLDO)
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  Temperature Sensor
    9. 7.9  Power Consumption - Power Modes
    10. 7.10 Power Consumption - Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy - Receive (RX)
    15. 7.15 Bluetooth Low Energy - Transmit (TX)
    16. 7.16 2.4GHz RX/TX CW
    17. 7.17 Timing and Switching Characteristics
      1. 7.17.1 Reset Timing
      2. 7.17.2 Wakeup Timing
      3. 7.17.3 Clock Specifications
        1. 7.17.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.17.3.2 48MHz RC Oscillator (HFOSC)
        3. 7.17.3.3 32kHz Crystal Oscillator (LFXT)
        4. 7.17.3.4 32kHz RC Oscillator (LFOSC)
    18. 7.18 Peripheral Characteristics
      1. 7.18.1 UART
        1. 7.18.1.1 UART Characteristics
      2. 7.18.2 SPI
        1. 7.18.2.1 SPI Characteristics
        2. 7.18.2.2 SPI Controller Mode
        3. 7.18.2.3 SPI Timing Diagrams - Controller Mode
        4. 7.18.2.4 SPI Peripheral Mode
        5. 7.18.2.5 SPI Timing Diagrams - Peripheral Mode
      3. 7.18.3 I2C
        1. 7.18.3.1 I2C
        2. 7.18.3.2 I2C Timing Diagram
      4. 7.18.4 GPIO
        1. 7.18.4.1 GPIO DC Characteristics
      5. 7.18.5 ADC
        1. 7.18.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 7.18.6 Comparators
        1. 7.18.6.1 Ultra-low power comparator
    19. 7.19 Typical Characteristics
      1. 7.19.1 MCU Current
      2. 7.19.2 RX Current
      3. 7.19.3 TX Current
      4. 7.19.4 RX Performance
      5. 7.19.5 TX Performance
      6. 7.19.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  µDMA
    10. 8.10 Debug
    11. 8.11 Power Management
    12. 8.12 Clock Systems
    13. 8.13 Network Processor
    14. 8.14 Device Certification and Qualification
      1. 8.14.1 FCC Certification and Statement
      2. 8.14.2 IC/ISED Certification and Statement
      3. 8.14.3 ETSI/CE Certification
      4. 8.14.4 MIC Certification
      5. 8.14.5 Korea Certification
      6. 8.14.6 NCC Certification and Statement
    15. 8.15 Module Markings
    16. 8.16 End Product Labeling
    17. 8.17 Manual Information to the End User
  10. 9 Application, Implementation, and Layout
    1. 9.1 Typical Application Circuit
    2. 9.2 Device Connections
      1. 9.2.1 Unused Pins
    3. 9.3 PCB Layout Guidelines
      1. 9.3.1 General Layout Recommendations
        1. 9.3.1.1 Typical RF Layout Recommendations with Integrated Antenna
        2. 9.3.1.2 RF Layout Recommendations with External Antenna
    4. 9.4 Reference Designs
  11. 10Environmental Requirements and SMT Specifications
    1. 10.1 PCB Bending
    2. 10.2 Handling Environment
      1. 10.2.1 Terminals
      2. 10.2.2 Falling
    3. 10.3 Storage Condition
      1. 10.3.1 Moisture Barrier Bag Before Opened
      2. 10.3.2 Moisture Barrier Bag Open
    4. 10.4 PCB Assembly Guide
      1. 10.4.1 PCB Land Pattern & Thermal Vias
      2. 10.4.2 SMT Assembly Recommendations
      3. 10.4.3 PCB Surface Finish Requirements
      4. 10.4.4 Solder Stencil
      5. 10.4.5 Package Placement
      6. 10.4.6 Solder Joint Inspection
      7. 10.4.7 Rework and Replacement
      8. 10.4.8 Solder Joint Voiding
    5. 10.5 Baking Conditions
    6. 10.6 SMT Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

9.1 Typical Application Circuit

Figure 9-1 shows the typical application schematic using the CC2340R5MODA module. RFIO (pin 4) is the conducted Tx and Rx RF port and ANT_IN (pin 3) is the connection to the integrated antenna. CA1 should be assembled when using the integrated antenna option within the module.

If using the external antenna option, CA2 should be assembled and CA1 should be removed. For the full reference schematic, download the LP-EM-CC2340R5MODA Design Files.

  • If a Power-On-Reset is required then components R1 and C92 should be added. R1 should be 100 kΩ and C92 should be 100 nF.
  • If a low-power oscillator is required for the application, then Y1 should be added with the load capacitors C81 and C91
Note:

The following guidelines are recommended for implementation of the RF design when using an external antenna on the RFIO path, pin 4:

  • Make sure the RF path is designed with an impedance of 50 Ω.
  • Tuning of the antenna impedance π matching network is recommended after manufacturing of the PCB to account for PCB parasitics.
CC2340R5MODA CC2340R5MODA Typical Application Schematic Figure 9-1 CC2340R5MODA Typical Application Schematic
Table 9-1 provides the bill of materials for a typical application using the CC2340R5MODA module with the internal antenna as shown in Figure 9-1.

For full operation reference design, see the LP-EM-CC2340R5MODA Design Files.

Table 9-1 Bill of Materials for Internal Antenna Configuration
PART REFERENCE VALUE MANUFACTURER PART NUMBER DESCRIPTION
CA1, CA2(1) 15 pF Murata GRM0335C1H150GA01D Capacitor, ceramic, 15 pF, 50 V, ±2%, C0G/NP0, 0201
U5 CC2340R5MODA Texas Instruments CC2340R5MODAN0MHAR SimpleLink™ multiprotocol 2.4-GHz wireless MCU with integrated power amplifier and Antenna
Y1 32.768kHz TAI-SAW TZ3359DAAO73 Crystal, resonator, 32.768kHz, -40oC / +125oC, SMD
(1) CA1 is placed when using the integrated antenna. CA2 is placed when using an external antenna