SWRS349A June   2026  – July 2026 CC2340R5MODA

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Functional Block Diagram
  6. 5 Device Comparison
  7. 6 Pin Configurations and Functions
    1. 6.1 Pin Diagrams
      1. 6.1.1 Pin Diagram - MHA Package (Top View)
    2.     10
    3. 6.2 Signal Descriptions
      1.      12
      2.      13
      3.      14
      4.      15
      5.      16
      6.      17
      7.      18
      8.      19
      9.      20
      10.      21
      11.      22
      12.      23
      13.      24
      14.      25
      15.      26
      16.      27
    4. 6.3 Connections for Unused Pins and Modules
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  DCDC
    5. 7.5  Global LDO (GLDO)
    6. 7.6  Power Supply and Modules
    7. 7.7  Battery Monitor
    8. 7.8  Temperature Sensor
    9. 7.9  Power Consumption - Power Modes
    10. 7.10 Power Consumption - Radio Modes
    11. 7.11 Nonvolatile (Flash) Memory Characteristics
    12. 7.12 Thermal Resistance Characteristics
    13. 7.13 RF Frequency Bands
    14. 7.14 Bluetooth Low Energy - Receive (RX)
    15. 7.15 Bluetooth Low Energy - Transmit (TX)
    16. 7.16 2.4GHz RX/TX CW
    17. 7.17 Timing and Switching Characteristics
      1. 7.17.1 Reset Timing
      2. 7.17.2 Wakeup Timing
      3. 7.17.3 Clock Specifications
        1. 7.17.3.1 48MHz Crystal Oscillator (HFXT)
        2. 7.17.3.2 48MHz RC Oscillator (HFOSC)
        3. 7.17.3.3 32kHz Crystal Oscillator (LFXT)
        4. 7.17.3.4 32kHz RC Oscillator (LFOSC)
    18. 7.18 Peripheral Characteristics
      1. 7.18.1 UART
        1. 7.18.1.1 UART Characteristics
      2. 7.18.2 SPI
        1. 7.18.2.1 SPI Characteristics
        2. 7.18.2.2 SPI Controller Mode
        3. 7.18.2.3 SPI Timing Diagrams - Controller Mode
        4. 7.18.2.4 SPI Peripheral Mode
        5. 7.18.2.5 SPI Timing Diagrams - Peripheral Mode
      3. 7.18.3 I2C
        1. 7.18.3.1 I2C
        2. 7.18.3.2 I2C Timing Diagram
      4. 7.18.4 GPIO
        1. 7.18.4.1 GPIO DC Characteristics
      5. 7.18.5 ADC
        1. 7.18.5.1 Analog-to-Digital Converter (ADC) Characteristics
      6. 7.18.6 Comparators
        1. 7.18.6.1 Ultra-low power comparator
    19. 7.19 Typical Characteristics
      1. 7.19.1 MCU Current
      2. 7.19.2 RX Current
      3. 7.19.3 TX Current
      4. 7.19.4 RX Performance
      5. 7.19.5 TX Performance
      6. 7.19.6 ADC Performance
  9. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  System CPU
    3. 8.3  Radio (RF Core)
      1. 8.3.1 Bluetooth Low Energy
    4. 8.4  Memory
    5. 8.5  Cryptography
    6. 8.6  Timers
    7. 8.7  Serial Peripherals and I/O
    8. 8.8  Battery and Temperature Monitor
    9. 8.9  µDMA
    10. 8.10 Debug
    11. 8.11 Power Management
    12. 8.12 Clock Systems
    13. 8.13 Network Processor
    14. 8.14 Device Certification and Qualification
      1. 8.14.1 FCC Certification and Statement
      2. 8.14.2 IC/ISED Certification and Statement
      3. 8.14.3 ETSI/CE Certification
      4. 8.14.4 MIC Certification
      5. 8.14.5 Korea Certification
      6. 8.14.6 NCC Certification and Statement
    15. 8.15 Module Markings
    16. 8.16 End Product Labeling
    17. 8.17 Manual Information to the End User
  10. 9 Application, Implementation, and Layout
    1. 9.1 Typical Application Circuit
    2. 9.2 Device Connections
      1. 9.2.1 Unused Pins
    3. 9.3 PCB Layout Guidelines
      1. 9.3.1 General Layout Recommendations
        1. 9.3.1.1 Typical RF Layout Recommendations with Integrated Antenna
        2. 9.3.1.2 RF Layout Recommendations with External Antenna
    4. 9.4 Reference Designs
  11. 10Environmental Requirements and SMT Specifications
    1. 10.1 PCB Bending
    2. 10.2 Handling Environment
      1. 10.2.1 Terminals
      2. 10.2.2 Falling
    3. 10.3 Storage Condition
      1. 10.3.1 Moisture Barrier Bag Before Opened
      2. 10.3.2 Moisture Barrier Bag Open
    4. 10.4 PCB Assembly Guide
      1. 10.4.1 PCB Land Pattern & Thermal Vias
      2. 10.4.2 SMT Assembly Recommendations
      3. 10.4.3 PCB Surface Finish Requirements
      4. 10.4.4 Solder Stencil
      5. 10.4.5 Package Placement
      6. 10.4.6 Solder Joint Inspection
      7. 10.4.7 Rework and Replacement
      8. 10.4.8 Solder Joint Voiding
    5. 10.5 Baking Conditions
    6. 10.6 SMT Recommendations
  12. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

8.14.5 Korea Certification

The CC2340R5MODA module from TI is Korea certified against article 58-2 and the relevant articles of the Radio Waves Act. In addition it is the responsibility of the OEM to ensure the Korea device, label, and user manual requirements are met per Table 8-5

Table 8-5 KCC Label and User Manual Requirements for EOM
KCC Label Requirements(1) Information Device(2)(3) Package(2)(3) User Manual(2)(3)
KC Mark CC2340R5MODA M M
KC ID R-C-T3P-2340R5MODA M M
Applicant Name Texas Instruments M, E M, E M, E
Product Name CC2340R5MODA SimpleLink™ 32-bit Arm Cortex-M0+ Bluetooth Low Energy wireless MCU module with 512-kB Flash M, E M, E M, E
Model Name CC2340R5MODAN0MHAR M, E M, E M, E
Manufacturer name Texas Instruments Inc. M,E M,E M,E
Manufacturing country Taiwan M, E M, E M, E
Manufacturing year 2026 M, E M, E M, E
(1) For small products with a maximum area of 400 mm2 or less, and where a label cannot be marked, the label can be attached to the product packaging or only a basic design, or identification code can be marked on the product.
(2) M = Mandatory
(3) E = OEM integrator can choose to where to place the information