TIDUE73A April   2018  – November 2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1 C2000 Real-Time MCU LaunchPad
      2. 2.2.2 SN65HVD78
      3. 2.2.3 TLV702
      4. 2.2.4 TPS22918-Q1
    3. 2.3 Design Considerations
      1. 2.3.1 BiSS-C Protocol
        1. 2.3.1.1 Line Delay Compensation
        2. 2.3.1.2 Processing Time Request by Encoder
        3. 2.3.1.3 Control Communication
      2. 2.3.2 C2000 BiSS-C Encoder Interface Overview
      3. 2.3.3 TIDM-1010 Board Implementation
      4. 2.3.4 MCU Resource Requirements
        1. 2.3.4.1 Input, Output Signals, and CLB Tiles
      5. 2.3.5 CLB BiSS-C Implementation Details
        1. 2.3.5.1 Transaction Waveforms
        2. 2.3.5.2 FRAME_STATE Generation
        3. 2.3.5.3 CLB_SPI_CLOCK Generation
        4. 2.3.5.4 ENCODER_CLOCK (MA) Generation
      6. 2.3.6 PM BiSS-C Interface Library
        1. 2.3.6.1 PM BiSS-C Library Functions
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware
      1. 3.1.1 TIDM-1010 Jumper Configuration
    2. 3.2 Software
      1. 3.2.1 C2000 Driver Library (DriverLib)
      2. 3.2.2 C2000 SysConfig
      3. 3.2.3 C2000 Configurable Logic Block Tool
      4. 3.2.4 Installing Code Composer Studio™ and C2000WARE-MOTORCONTROL-SDK
      5. 3.2.5 Locating the Reference Software
    3. 3.3 Testing and Results
      1. 3.3.1 Hardware Configuration
      2. 3.3.2 Building and Loading Project
      3. 3.3.3 Running Example Code
      4. 3.3.4 Encoder Test
      5. 3.3.5 Benchmarks
      6. 3.3.6 Troubleshooting
  10. 4Design Files
  11. 5Software Files
  12. 6Related Documentation
    1.     Trademarks
  13. 7Terminology
  14. 8About the Authors
  15. 9Revision History

2.3.3 TIDM-1010 Board Implementation

The TIDM-1010 board provides the following:

  • Differential line driver and receiver for RS-485 communication between a C2000 MCU and the encoder.
  • TxEN signal routed from the MCU to the direction control of the RS-485 driver/receiver. For the BiSS-C implementation, this signal is held low.
  • SPICLK signal routed to a GPIO where it can be controlled by the CLB peripheral. This connection is optional for all supported devices except the F2837xD, F2837xS and F28007x devices. On other devices, the CLB is capable of clocking the SPI peripheral within the device itself.
  • Note: The TIDM-1010 board is identical to the Position Manager BoosterPack (BOOSTXL-POSMGR), which means the TIDM-1010 board can interface with several other position encoder types. The board is fully populated by default for future compatibility. This reference design focuses on the BiSS-C, and the hardware blocks not mentioned in this document can be ignored.

Table 2-2 lists the connectors on the TIDM-1010 BiSS-C implementation and the functions of these connectors.

Table 2-2 TIDM-1010 Board and BOOSTXL-POSMGR Connectors
CONNECTORDESCRIPTIONUSED BY TIDM-1010
Abs-Enc-1 (J7)BiSS-C and other absolute encodersYes, LaunchPad Site 2
Abs-Enc-2 (J8)BiSS-C and other absolute encodersNo
Abs-Enc-2 Breakout (J10)Allows two absolute encoders at site two using jumpersNo
SinCos (J14)SinCos encoderNo
Resolver (J14 and J15)Resolver interface with 15-V excitation circuitryNo
PTO (J17)Pulse-train outputNo
J1, J3 and J4, J2BoosterPack connectorYes
J65-V DC supply inputYes
J1615-V DC resolver excitation inputNo

Figure 2-8 describes the encoder support at each site of the LaunchPad development kit.

TIDM-1010 TIDM-1010 Board and BOOSTXL-POSMGR Encoder SupportFigure 2-8 TIDM-1010 Board and BOOSTXL-POSMGR Encoder Support

As provided, TIDM-1010 uses LaunchPad Site 2 and BOOSTXL-POSMGR's Encoder 1 connections. Figure 2-9 shows the connections. The complete schematic of the TIDM-1010 BoosterPack can be downloaded from the BOOSTXL-POSMGR product page.

TIDM-1010 BoosterPack Block Diagram Figure 2-9 BoosterPack Block Diagram