TIDUE73A April   2018  – November 2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Highlighted Products
      1. 2.2.1 C2000 Real-Time MCU LaunchPad
      2. 2.2.2 SN65HVD78
      3. 2.2.3 TLV702
      4. 2.2.4 TPS22918-Q1
    3. 2.3 Design Considerations
      1. 2.3.1 BiSS-C Protocol
        1. 2.3.1.1 Line Delay Compensation
        2. 2.3.1.2 Processing Time Request by Encoder
        3. 2.3.1.3 Control Communication
      2. 2.3.2 C2000 BiSS-C Encoder Interface Overview
      3. 2.3.3 TIDM-1010 Board Implementation
      4. 2.3.4 MCU Resource Requirements
        1. 2.3.4.1 Input, Output Signals, and CLB Tiles
      5. 2.3.5 CLB BiSS-C Implementation Details
        1. 2.3.5.1 Transaction Waveforms
        2. 2.3.5.2 FRAME_STATE Generation
        3. 2.3.5.3 CLB_SPI_CLOCK Generation
        4. 2.3.5.4 ENCODER_CLOCK (MA) Generation
      6. 2.3.6 PM BiSS-C Interface Library
        1. 2.3.6.1 PM BiSS-C Library Functions
  9. 3Hardware, Software, Testing Requirements, and Test Results
    1. 3.1 Hardware
      1. 3.1.1 TIDM-1010 Jumper Configuration
    2. 3.2 Software
      1. 3.2.1 C2000 Driver Library (DriverLib)
      2. 3.2.2 C2000 SysConfig
      3. 3.2.3 C2000 Configurable Logic Block Tool
      4. 3.2.4 Installing Code Composer Studio™ and C2000WARE-MOTORCONTROL-SDK
      5. 3.2.5 Locating the Reference Software
    3. 3.3 Testing and Results
      1. 3.3.1 Hardware Configuration
      2. 3.3.2 Building and Loading Project
      3. 3.3.3 Running Example Code
      4. 3.3.4 Encoder Test
      5. 3.3.5 Benchmarks
      6. 3.3.6 Troubleshooting
  10. 4Design Files
  11. 5Software Files
  12. 6Related Documentation
    1.     Trademarks
  13. 7Terminology
  14. 8About the Authors
  15. 9Revision History

3.3.1 Hardware Configuration

  1. Make sure that the jumper configuration of the TIDM-1010 device is as described in Table 3-1.
  2. Connect the TIDM-1010 device to the LaunchPad using the BoosterPack site-two connector (J1, J3 and J4, J2). Make sure the TIDM-1010 device is connected to site two of the LaunchPad, as shown in Figure 3-4.
    TIDM-1010 TIDM-1010 Board Connected to Site Two of LaunchPad™ Figure 3-4 TIDM-1010 Board Connected to Site Two of LaunchPad™
  3. Connect the USB cable to the LaunchPad.
  4. Connect to the encoder:
    1. Prepare an adapter to connect the cable to the BiSS-C interface using the circular female to wire the leads adapter (see the BOM for the header used for the encoder connector, J7).
    2. Connect CLK+/CLK- to the BiSS-C MA+/MA- signal of the encoder.
    3. Connect DATA+/DATA- to the encoder's response SL+/SL-.
    4. Insert the header of the adapter created in the previous step to connect to Abs-Enc-1 (J7). The female end of the cable connects to the encoder. Figure 3-5 shows the pinout of J7.
      TIDM-1010 Abs-Enc-1 (J7) Pinout on TIDM-1010 Board Figure 3-5 Abs-Enc-1 (J7) Pinout on TIDM-1010 Board
  5. Supply 5-V DC and GND to J6, as shown in Figure 3-1. The board now looks like Figure 3-6. BoosterPack LED D18 turns on, which shows that the board has power.
    Note: For some encoders the BoosterPack may not provide an adequate current at power up. If the encoder fails to respond, try connecting a power supply external to the BoosterPack to the encoder. If this is done, connect a common ground to the BoosterPack.
    TIDM-1010 TIDM-1010 Board Connected to BiSS-C Encoder Figure 3-6 TIDM-1010 Board Connected to BiSS-C Encoder