TIDUF65 March   2024

 

  1.   1
  2.   Description
  3.   Resources
  4.   Features
  5.   Applications
  6.   6
  7. 1System Description
    1. 1.1 Key System Specifications
  8. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Consideration
    3. 2.3 Highlighted Products
      1. 2.3.1 TMCS1123
      2. 2.3.2 ADS7043
      3. 2.3.3 AMC1035
      4. 2.3.4 REF2033
  9. 3System Design Theory
    1. 3.1 Hall-Effect Current Sensor Schematic Design
    2. 3.2 Analog-to-Digital Converter
      1. 3.2.1 Delta-Sigma Modulator
        1. 3.2.1.1 Common-Mode Voltage Limit
        2. 3.2.1.2 Input Filter
        3. 3.2.1.3 Interface to MCU
      2. 3.2.2 12-bit SAR ADC
        1. 3.2.2.1 Common-Mode Voltage Limit
        2. 3.2.2.2 Input Filter
        3. 3.2.2.3 Interface to MCU
    3. 3.3 Power Supply and Reference Voltage
  10. 4Hardware, Software, Testing Requirements, and Test Results
    1. 4.1 Hardware Requirements
    2. 4.2 Software Requirements
    3. 4.3 Test Setup
      1. 4.3.1 Precautions
    4. 4.4 Test Results
      1. 4.4.1 DC Performance
        1. 4.4.1.1 Output Voltage Noise and ENOB After A/D Conversion
        2. 4.4.1.2 Linearity and Temperature Drift
      2. 4.4.2 AC Performance
        1. 4.4.2.1 SNR Measurement
        2. 4.4.2.2 Latency Test
      3. 4.4.3 PWM Rejection
      4. 4.4.4 Overcurrent Response
      5. 4.4.5 Adjacent Current Rejection
      6. 4.4.6 Power Supply Rejection Ratio
      7. 4.4.7 Digital Interface
  11. 5Performance Comparison with Competitor’s Device
    1. 5.1 Effective Number of Bits
    2. 5.2 Latency
    3. 5.3 PWM Rejection
  12. 6Design and Documentation Support
    1. 6.1 Design Files
      1. 6.1.1 Schematics
      2. 6.1.2 BOM
      3. 6.1.3 PCB Layout Recommendations
        1. 6.1.3.1 Layout Prints
    2. 6.2 Tools and Software
    3. 6.3 Documentation Support
    4. 6.4 Support Resources
    5. 6.5 Trademarks
  13. 7About the Author

4.3.1 Precautions

This reference design is a reinforced isolated in-phase current sensing using the TMCS1123 for a 3-phase inverter. The input common mode voltage can be up to 600VDC (MAX); therefore, the PCB is exposed to voltages above 60VDC and 25VAC so extreme care must be exercised while testing.

This reference design is meant for exploring TI’s technology in a lab space only and to be used by professional engineers, who are qualified to work with high voltage. Users must make sure proper high-voltage safety precautions are observed before and while testing. Do not directly handle any exposed terminals (high voltage or otherwise) while the power is turned on. All connections must be done while the reference design is de-energized and not powered-up. Even during operation at room temperature around 25°C, some components and parts of the PCB surface can reach temperatures higher than 100°C. A high temperature warning symbol is added to the PCB. Do not touch the PCB as contact can cause burns. After removing power from the PCB, let the PCB cool down for some time before handling the board again.

WARNING:
GUID-E47B49AC-A9B8-4FE0-B8F0-0EC65493F6B3-low.gif Danger! High Voltage. Electric shock is possible when connecting the board to live wire. The board must be handled with care only by a professional person, qualified to work with high voltage. For safety, use of isolated test equipment with overvoltage and overcurrent protection is highly recommended.
WARNING:
GUID-6C26CEE3-4697-4A3D-A1B3-6BB6CE602F17-low.gif Hot surface! Contact can cause burns. Do not touch!
WARNING:
GUID-CCF5DAE3-BA7A-41C4-993C-61CC637CBC0F-low.gif Do not leave the board powered when unattended.